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School of Engineering

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Engineering of Microwaves, Terahertz and Light (E-MIT)

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Modelling the behaviour of soldier joints for wafer level SIP.

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

Published

Hongyuan Liu
N. Strusevich
S. Stoyanov
C. Bailey
Andrew M. D. Richardson
N. Dumas
J. M. Yannou
V. Georgel

Publication date	2006
Host publication	Proceedings of the 8th IEEE electronics packaging technology conference.
<mark>Original language</mark>	English