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3DB challenge for DfT, DfM, DOT and BIST integr...
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School of Engineering
Associated organisational unit
Engineering of Microwaves, Terahertz and Light (E-MIT)
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3DB challenge for DfT, DfM, DOT and BIST integration into analogue and mixed signal ICs.
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Contribution in Book/Report/Proceedings - With ISBN/ISSN
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Chapter
Published
Overview
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A. Lechner
M. J. Burbidge
Andrew M. D. Richardson
B. Hermes
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Publication date
2001
Host publication
Proceedings of the 2nd Latin-American test workshop (LATW ’01)
Pages
194-199
Number of pages
6
<mark>Original language</mark>
English