Research output: Contribution in Book/Report/Proceedings › Conference contribution
|Host publication||European Design and Test Conference, 1997. ED&TC 97. Proceedings|
|Place of publication||LOS ALAMITOS|
|Publisher||I E E E, COMPUTER SOC PRESS|
|Number of pages||8|
IC product quality is commonly described as the faulty device level at shipment and is becoming an increasingly important metric in the Microelectronics Industry. This paper presents and demonstrates a qualify estimation approach based on Inductive Fault Analysis for mixed-signal and analogue ICs, that quantitatively models the qualify related parameters prior to production. It is shown how the approach can be used to optimise the manufacturing test program.