Home > Research > Publications & Outputs > Bringing Multi-Domain Functions to Intelligent ...
View graph of relations

Bringing Multi-Domain Functions to Intelligent Systems through MEMS Technology Platforms – The INTEGRAMplus Access Service.

Research output: Contribution to Journal/MagazineJournal articlepeer-review

Published

Standard

Bringing Multi-Domain Functions to Intelligent Systems through MEMS Technology Platforms – The INTEGRAMplus Access Service. / Richardson, Andrew; Pickering, Chris; McNie, Mark et al.
In: MST News (VDI/VDE Technologiezentrum Informationstechnic), No. 4, 2006, p. 38-40.

Research output: Contribution to Journal/MagazineJournal articlepeer-review

Harvard

Richardson, A, Pickering, C, McNie, M, Reeves, C, Schropfer, G, Knapp, H & Bosshard, C 2006, 'Bringing Multi-Domain Functions to Intelligent Systems through MEMS Technology Platforms – The INTEGRAMplus Access Service.', MST News (VDI/VDE Technologiezentrum Informationstechnic), no. 4, pp. 38-40. <http://www.mstnews.de/>

APA

Richardson, A., Pickering, C., McNie, M., Reeves, C., Schropfer, G., Knapp, H., & Bosshard, C. (2006). Bringing Multi-Domain Functions to Intelligent Systems through MEMS Technology Platforms – The INTEGRAMplus Access Service. MST News (VDI/VDE Technologiezentrum Informationstechnic), (4), 38-40. http://www.mstnews.de/

Vancouver

Richardson A, Pickering C, McNie M, Reeves C, Schropfer G, Knapp H et al. Bringing Multi-Domain Functions to Intelligent Systems through MEMS Technology Platforms – The INTEGRAMplus Access Service. MST News (VDI/VDE Technologiezentrum Informationstechnic). 2006;(4):38-40.

Author

Richardson, Andrew ; Pickering, Chris ; McNie, Mark et al. / Bringing Multi-Domain Functions to Intelligent Systems through MEMS Technology Platforms – The INTEGRAMplus Access Service. In: MST News (VDI/VDE Technologiezentrum Informationstechnic). 2006 ; No. 4. pp. 38-40.

Bibtex

@article{4be65572857e47a89e7b1adce88a7f83,
title = "Bringing Multi-Domain Functions to Intelligent Systems through MEMS Technology Platforms – The INTEGRAMplus Access Service.",
abstract = "Nanotechnology embraces many disciplines, devices and materials. These range from very deep submicron electronic devices including carbon nanotubes, resonant tunnelling devices, and next generation CMOS, through to functional materials such as bio-chemical monolayers and selfassembling molecules. It is widely recognised that to extract the performance benefits from these technologies, suitable carriers and interfaces must be developed to support delivery of electrical or physical input and output and provide a “quiet” electromagnetic and mechanical environment for the active structures. The FP6 Europractice-like Service Project {\textquoteleft}INTEGRAMplus{\textquoteright} aims to provide industrial and academic access to multi-technology MEMS platforms that target both today{\textquoteright}s requirements for products based on Microsystems Technologies and tomorrow{\textquoteright}s trends towards the exploitation of nanotechnology for new functionality within electronic systems. The INTEGRAMplus technology base is focused on the integration of polymer and silicon technologies. In general the concept is to use polymers for both packaging of active siliconbased devices and to provide fluidic interfaces and delivery functions to silicon-based bio-chemical sensors. This article presents the foundations of the INTEGRAMplus technologies and vision together with potential applications.",
keywords = "Microsystems, MEMS Integration, Polymer / Silicon convergence, microfluidics",
author = "Andrew Richardson and Chris Pickering and Mark McNie and Chris Reeves and Gerold Schropfer and Helmut Knapp and Christian Bosshard",
year = "2006",
language = "English",
pages = "38--40",
journal = "MST News (VDI/VDE Technologiezentrum Informationstechnic)",
issn = "0948-3128",
number = "4",

}

RIS

TY - JOUR

T1 - Bringing Multi-Domain Functions to Intelligent Systems through MEMS Technology Platforms – The INTEGRAMplus Access Service.

AU - Richardson, Andrew

AU - Pickering, Chris

AU - McNie, Mark

AU - Reeves, Chris

AU - Schropfer, Gerold

AU - Knapp, Helmut

AU - Bosshard, Christian

PY - 2006

Y1 - 2006

N2 - Nanotechnology embraces many disciplines, devices and materials. These range from very deep submicron electronic devices including carbon nanotubes, resonant tunnelling devices, and next generation CMOS, through to functional materials such as bio-chemical monolayers and selfassembling molecules. It is widely recognised that to extract the performance benefits from these technologies, suitable carriers and interfaces must be developed to support delivery of electrical or physical input and output and provide a “quiet” electromagnetic and mechanical environment for the active structures. The FP6 Europractice-like Service Project ‘INTEGRAMplus’ aims to provide industrial and academic access to multi-technology MEMS platforms that target both today’s requirements for products based on Microsystems Technologies and tomorrow’s trends towards the exploitation of nanotechnology for new functionality within electronic systems. The INTEGRAMplus technology base is focused on the integration of polymer and silicon technologies. In general the concept is to use polymers for both packaging of active siliconbased devices and to provide fluidic interfaces and delivery functions to silicon-based bio-chemical sensors. This article presents the foundations of the INTEGRAMplus technologies and vision together with potential applications.

AB - Nanotechnology embraces many disciplines, devices and materials. These range from very deep submicron electronic devices including carbon nanotubes, resonant tunnelling devices, and next generation CMOS, through to functional materials such as bio-chemical monolayers and selfassembling molecules. It is widely recognised that to extract the performance benefits from these technologies, suitable carriers and interfaces must be developed to support delivery of electrical or physical input and output and provide a “quiet” electromagnetic and mechanical environment for the active structures. The FP6 Europractice-like Service Project ‘INTEGRAMplus’ aims to provide industrial and academic access to multi-technology MEMS platforms that target both today’s requirements for products based on Microsystems Technologies and tomorrow’s trends towards the exploitation of nanotechnology for new functionality within electronic systems. The INTEGRAMplus technology base is focused on the integration of polymer and silicon technologies. In general the concept is to use polymers for both packaging of active siliconbased devices and to provide fluidic interfaces and delivery functions to silicon-based bio-chemical sensors. This article presents the foundations of the INTEGRAMplus technologies and vision together with potential applications.

KW - Microsystems

KW - MEMS Integration

KW - Polymer / Silicon convergence

KW - microfluidics

M3 - Journal article

SP - 38

EP - 40

JO - MST News (VDI/VDE Technologiezentrum Informationstechnic)

JF - MST News (VDI/VDE Technologiezentrum Informationstechnic)

SN - 0948-3128

IS - 4

ER -