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Research output: Contribution to Journal/Magazine › Journal article › peer-review
Research output: Contribution to Journal/Magazine › Journal article › peer-review
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TY - JOUR
T1 - Copper underpotential deposition on boron nitride nanomesh
AU - Mertens, S.F.L.
PY - 2017/8/20
Y1 - 2017/8/20
N2 - The boron nitride nanomesh is a corrugated monolayer of hexagonal boron nitride (h-BN) on Rh(111), which so far has been studied mostly under ultrahigh vacuum conditions. Here, we investigate how copper underpotential deposition (upd) can be used to quantify defects in the boron nitride monolayer and to assess the potential window of the nanomesh, which is important to explore its functionality under ambient and electrochemical conditions. In dilute sulfuric acid, the potential window of h-BN/Rh(111) is close to 1 volt, i.e. larger than that of the Rh substrate, and is limited by molecular hydrogen evolution on the negative and by oxidative removal on the positive side. From copper upd on pristine h-BN/Rh(111) wafer samples, we estimate a collective defect fraction on the order of 0.08–0.7% of the geometric area, which may arise from line and point defects in the h-BN layer that are created during its chemical vapour deposition. Overpotential deposition (opd) is demonstrated to have significant consequences on the defect area. We hypothesise that this non-innocent Cu electrodeposition involves intercalation originating at initial defects, causing irreversible delamination of the h-BN layer; this effect may be used for 2D material nanoengineering. On the relevant timescale, upd itself does not alter the defect area on repeated cycling; therefore, metal upd may find use as a general tool to determine the collective defect area in hybrids between 2D materials and various substrate metals. © 2017
AB - The boron nitride nanomesh is a corrugated monolayer of hexagonal boron nitride (h-BN) on Rh(111), which so far has been studied mostly under ultrahigh vacuum conditions. Here, we investigate how copper underpotential deposition (upd) can be used to quantify defects in the boron nitride monolayer and to assess the potential window of the nanomesh, which is important to explore its functionality under ambient and electrochemical conditions. In dilute sulfuric acid, the potential window of h-BN/Rh(111) is close to 1 volt, i.e. larger than that of the Rh substrate, and is limited by molecular hydrogen evolution on the negative and by oxidative removal on the positive side. From copper upd on pristine h-BN/Rh(111) wafer samples, we estimate a collective defect fraction on the order of 0.08–0.7% of the geometric area, which may arise from line and point defects in the h-BN layer that are created during its chemical vapour deposition. Overpotential deposition (opd) is demonstrated to have significant consequences on the defect area. We hypothesise that this non-innocent Cu electrodeposition involves intercalation originating at initial defects, causing irreversible delamination of the h-BN layer; this effect may be used for 2D material nanoengineering. On the relevant timescale, upd itself does not alter the defect area on repeated cycling; therefore, metal upd may find use as a general tool to determine the collective defect area in hybrids between 2D materials and various substrate metals. © 2017
KW - 2D materials
KW - boron nitride
KW - electrodeposition
KW - intercalation
KW - nanomesh
KW - opd
KW - rhodium
KW - upd
KW - Boron nitride
KW - Chemical vapor deposition
KW - Copper
KW - Deposition
KW - Electrodeposition
KW - Electrodes
KW - Intercalation
KW - Monolayers
KW - Nitrides
KW - Point defects
KW - Rhodium
KW - Vapor deposition
KW - Chemical vapour deposition
KW - Cu electrodepositions
KW - Electrochemical conditions
KW - Hexagonal boron nitride (h-BN)
KW - Nanomesh
KW - Overpotential deposition
KW - Ultrahigh vacuum conditions
KW - Underpotential deposition
KW - Defects
U2 - 10.1016/j.electacta.2017.06.082
DO - 10.1016/j.electacta.2017.06.082
M3 - Journal article
VL - 246
SP - 730
EP - 736
JO - Electrochimica Acta
JF - Electrochimica Acta
SN - 0013-4686
ER -