Rights statement: © 2019 American Physical Society
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Rights statement: © 2019 American Physical Society
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Final published version
Research output: Contribution to Journal/Magazine › Journal article › peer-review
Research output: Contribution to Journal/Magazine › Journal article › peer-review
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TY - JOUR
T1 - Correlation of shear forces and heat conductance in nanoscale junctions
AU - Robinson, Benjamin
AU - Pumarol Crestar, Manuel
AU - Kolosov, Oleg
N1 - © 2019 American Physical Society
PY - 2019/12/16
Y1 - 2019/12/16
N2 - Nanoscale solid-solid contacts are key elements which determine the electrical and thermal behavior of modern electronic devices and micro- and nanoelectromechanical systems. Here we show that simultaneous measurements of the shear force and the heat flow in nanoscale junctions reveal a linear correlation between thermal conductance and maximal shear force, confirming the ballistic nature of heat transport in the junction. Furthermore, we find that here the shear strength and thermal conductance in nanoscale contacts for materials where heat transport is phonon dominated can be linked via the fundamental material properties of heat capacity and group velocity of the heat carriers.
AB - Nanoscale solid-solid contacts are key elements which determine the electrical and thermal behavior of modern electronic devices and micro- and nanoelectromechanical systems. Here we show that simultaneous measurements of the shear force and the heat flow in nanoscale junctions reveal a linear correlation between thermal conductance and maximal shear force, confirming the ballistic nature of heat transport in the junction. Furthermore, we find that here the shear strength and thermal conductance in nanoscale contacts for materials where heat transport is phonon dominated can be linked via the fundamental material properties of heat capacity and group velocity of the heat carriers.
U2 - 10.1103/PhysRevB.100.235426
DO - 10.1103/PhysRevB.100.235426
M3 - Journal article
VL - 100
JO - Physical Review B: Condensed Matter and Materials Physics
JF - Physical Review B: Condensed Matter and Materials Physics
SN - 2469-9950
IS - 23
M1 - 235426
ER -