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Magnetoresistance in electrodeposited Ni-Fe-Cu/Cu multilayers

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<mark>Journal publication date</mark>07/1995
<mark>Journal</mark>Journal of Magnetism and Magnetic Materials
Issue number1-2
Volume148
Number of pages2
Pages (from-to)335-336
<mark>State</mark>Published
<mark>Original language</mark>English

Abstract

Multilayers of Ni-Fe-Cu/Cu have been electrodeposited from a single electrolyte onto polycrystalline (100) textured and (100) single crystal copper substrates. Bilayer thicknesses as low as 30 Angstrom have been achieved, as confirmed by X-ray diffraction. Room temperature magnetoresistance measurements show the presence of giant magnetoresistance (GMR) and an anisotropic magnetoresistance (AMR) component in the films.