Home > Research > Publications & Outputs > Mixed signal test - Techniques, applications an...

Associated organisational unit

View graph of relations

Mixed signal test - Techniques, applications and demands

Research output: Contribution to journalJournal article


<mark>Journal publication date</mark>12/1996
<mark>Journal</mark>IEE Proceedings - Circuits, Devices and Systems
Issue number6
Number of pages8
Pages (from-to)358-365
<mark>Original language</mark>English


The increasing importance of next generation test technology to provide high quality, low cost fault detection methodologies is becoming a big issue in the microelectronics industry. For digital ASICs, techniques such as I-ddq and built-in-self test are being introduced to supplement or in some cases replace stuck-at-testing that has been shown to be inadequate for the circuit complexities and quality levels demanded. For analogue and mixed signal ICs, a similar trend is evident. Increasing circuit complexity, higher performance and the demand for high quality levels is causing the industry to question currently used functional and specification based test programs. In addition, the escalating costs of production test equipment capable of measuring high performance device parameters is in many cases becoming a limiting factor. The authors review the current state-of-the-art in mixed signal and analogue test technology with particular reference to the consumer electronics industry. Trends in key issues such as design-for-test, fault simulation, defect detection, CAD and tester support are discussed and the possible future role of these techniques is proposed for the next generation of single chip analogue and mixed signal test systems.