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Mixed signal test - Techniques, applications and demands

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Mixed signal test - Techniques, applications and demands. / Baker, K ; Richardson, A M ; Dorey, A P .
In: IEE Proceedings - Circuits, Devices and Systems, Vol. 143, No. 6, 12.1996, p. 358-365.

Research output: Contribution to Journal/MagazineJournal articlepeer-review

Harvard

Baker, K, Richardson, AM & Dorey, AP 1996, 'Mixed signal test - Techniques, applications and demands', IEE Proceedings - Circuits, Devices and Systems, vol. 143, no. 6, pp. 358-365. https://doi.org/10.1049/ip-cds:19960904

APA

Vancouver

Baker K, Richardson AM, Dorey AP. Mixed signal test - Techniques, applications and demands. IEE Proceedings - Circuits, Devices and Systems. 1996 Dec;143(6):358-365. doi: 10.1049/ip-cds:19960904

Author

Baker, K ; Richardson, A M ; Dorey, A P . / Mixed signal test - Techniques, applications and demands. In: IEE Proceedings - Circuits, Devices and Systems. 1996 ; Vol. 143, No. 6. pp. 358-365.

Bibtex

@article{4bb27dd98fee411a910021d1be9ab019,
title = "Mixed signal test - Techniques, applications and demands",
abstract = "The increasing importance of next generation test technology to provide high quality, low cost fault detection methodologies is becoming a big issue in the microelectronics industry. For digital ASICs, techniques such as I-ddq and built-in-self test are being introduced to supplement or in some cases replace stuck-at-testing that has been shown to be inadequate for the circuit complexities and quality levels demanded. For analogue and mixed signal ICs, a similar trend is evident. Increasing circuit complexity, higher performance and the demand for high quality levels is causing the industry to question currently used functional and specification based test programs. In addition, the escalating costs of production test equipment capable of measuring high performance device parameters is in many cases becoming a limiting factor. The authors review the current state-of-the-art in mixed signal and analogue test technology with particular reference to the consumer electronics industry. Trends in key issues such as design-for-test, fault simulation, defect detection, CAD and tester support are discussed and the possible future role of these techniques is proposed for the next generation of single chip analogue and mixed signal test systems.",
keywords = "IC testing, mixed signal ICs, analogue ICs, design-for-test, fault simulation, ANALOG",
author = "K Baker and Richardson, {A M} and Dorey, {A P}",
year = "1996",
month = dec,
doi = "10.1049/ip-cds:19960904",
language = "English",
volume = "143",
pages = "358--365",
journal = "IEE Proceedings - Circuits, Devices and Systems",
issn = "1350-2409",
publisher = "Institute of Electrical Engineers",
number = "6",

}

RIS

TY - JOUR

T1 - Mixed signal test - Techniques, applications and demands

AU - Baker, K

AU - Richardson, A M

AU - Dorey, A P

PY - 1996/12

Y1 - 1996/12

N2 - The increasing importance of next generation test technology to provide high quality, low cost fault detection methodologies is becoming a big issue in the microelectronics industry. For digital ASICs, techniques such as I-ddq and built-in-self test are being introduced to supplement or in some cases replace stuck-at-testing that has been shown to be inadequate for the circuit complexities and quality levels demanded. For analogue and mixed signal ICs, a similar trend is evident. Increasing circuit complexity, higher performance and the demand for high quality levels is causing the industry to question currently used functional and specification based test programs. In addition, the escalating costs of production test equipment capable of measuring high performance device parameters is in many cases becoming a limiting factor. The authors review the current state-of-the-art in mixed signal and analogue test technology with particular reference to the consumer electronics industry. Trends in key issues such as design-for-test, fault simulation, defect detection, CAD and tester support are discussed and the possible future role of these techniques is proposed for the next generation of single chip analogue and mixed signal test systems.

AB - The increasing importance of next generation test technology to provide high quality, low cost fault detection methodologies is becoming a big issue in the microelectronics industry. For digital ASICs, techniques such as I-ddq and built-in-self test are being introduced to supplement or in some cases replace stuck-at-testing that has been shown to be inadequate for the circuit complexities and quality levels demanded. For analogue and mixed signal ICs, a similar trend is evident. Increasing circuit complexity, higher performance and the demand for high quality levels is causing the industry to question currently used functional and specification based test programs. In addition, the escalating costs of production test equipment capable of measuring high performance device parameters is in many cases becoming a limiting factor. The authors review the current state-of-the-art in mixed signal and analogue test technology with particular reference to the consumer electronics industry. Trends in key issues such as design-for-test, fault simulation, defect detection, CAD and tester support are discussed and the possible future role of these techniques is proposed for the next generation of single chip analogue and mixed signal test systems.

KW - IC testing

KW - mixed signal ICs

KW - analogue ICs

KW - design-for-test

KW - fault simulation

KW - ANALOG

U2 - 10.1049/ip-cds:19960904

DO - 10.1049/ip-cds:19960904

M3 - Journal article

VL - 143

SP - 358

EP - 365

JO - IEE Proceedings - Circuits, Devices and Systems

JF - IEE Proceedings - Circuits, Devices and Systems

SN - 1350-2409

IS - 6

ER -