By combining low-cost printed circuit board technology and focused ion beam techniques, a simple method has been developed to produce thermal microsensors in a robust package with straightforward electrical connectivity. Two devices have been developed to demonstrate the principle. The first was fabricated using a single step process comprised of FIB deposited platinum. The second device utilised a multistep process using FIB milled thermally evaporated Au on a PCB platform with through-plated vias. The performance of these devices was tested by measuring their thermo-electrical characteristics.