Sensor Testing Through Bias Superposition.

School of Engineering

Research output: Contribution to Journal/Magazine › Journal article › peer-review

Published

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Sensor Testing Through Bias Superposition. / Richardson, Andrew M. D.; Bunyan, R.; Mathias, H. et al.
In: Sensors and Actuators A: Physical, Vol. 136, No. 1, 01.05.2007, p. 441-455.

Research output: Contribution to Journal/Magazine › Journal article › peer-review

Harvard

Richardson, AMD, Bunyan, R, Mathias, H & Nouet, P 2007, 'Sensor Testing Through Bias Superposition.', Sensors and Actuators A: Physical, vol. 136, no. 1, pp. 441-455. https://doi.org/10.1016/j.sna.2006.11.030

APA

Richardson, A. M. D., Bunyan, R., Mathias, H., & Nouet, P. (2007). Sensor Testing Through Bias Superposition. Sensors and Actuators A: Physical, 136(1), 441-455. https://doi.org/10.1016/j.sna.2006.11.030

Vancouver

Richardson AMD, Bunyan R, Mathias H, Nouet P. Sensor Testing Through Bias Superposition. Sensors and Actuators A: Physical. 2007 May 1;136(1):441-455. doi: 10.1016/j.sna.2006.11.030

Author

Richardson, Andrew M. D. ; Bunyan, R. ; Mathias, H. et al. / Sensor Testing Through Bias Superposition. In: Sensors and Actuators A: Physical. 2007 ; Vol. 136, No. 1. pp. 441-455.

Bibtex

@article{d02e8846168a4ad585748e94af4d5379,

title = "Sensor Testing Through Bias Superposition.",

abstract = "A novel on-line monitoring technique for integrated MEMS is presented based on injection of an electrical test stimulus into the bias structure through both superposition or modulation. The techniques “bias superposition and bias modulation” both support integrated structural test that targets both production test and on-line condition monitoring through generation of dependability metric. It can in some cases be used to provide the raw data for on-line calibration and compensation. The techniques are demonstrated on three integrated MEMS structures from the field of consumer electronics, aerospace and environmental sensing and have been successfully applied to a thick film conductance sensor.",

keywords = "Sensors, On-line monitoring, Condition monitoring, Design for Testability, Test, MEMS",

author = "Richardson, {Andrew M. D.} and R. Bunyan and H. Mathias and P. Nouet",

note = "The first full paper on a new on-line embedded test strategy for MEMS, where my team developed the concept and extended it in collaboration with CNRS (Montpellier), University of Paris Sud and QinetiQ UK. The concepts are applied to three very different demonstrators, two industrial, one academic. Results from one of the demonstrators are being further developed for industrial application (ref RJBunyan@QinetiQ.com) Academic impact maximised through financial support and dissemination activities care of the EU FP6 Network of Excellence in Design for Micro & Nano-Manufacture (507255) and DTI Foresight Vehicle Project GR/N36271/01 'Design for Reliability for Electronics in Automotive Manufacture. RAE_import_type : Journal article RAE_uoa_type : General Engineering",

year = "2007",

month = may,

day = "1",

doi = "10.1016/j.sna.2006.11.030",

language = "English",

volume = "136",

pages = "441--455",

journal = "Sensors and Actuators A: Physical",

issn = "0924-4247",

publisher = "Elsevier",

number = "1",

}

RIS

TY - JOUR

T1 - Sensor Testing Through Bias Superposition.

AU - Richardson, Andrew M. D.

AU - Bunyan, R.

AU - Mathias, H.

AU - Nouet, P.

N1 - The first full paper on a new on-line embedded test strategy for MEMS, where my team developed the concept and extended it in collaboration with CNRS (Montpellier), University of Paris Sud and QinetiQ UK. The concepts are applied to three very different demonstrators, two industrial, one academic. Results from one of the demonstrators are being further developed for industrial application (ref RJBunyan@QinetiQ.com) Academic impact maximised through financial support and dissemination activities care of the EU FP6 Network of Excellence in Design for Micro & Nano-Manufacture (507255) and DTI Foresight Vehicle Project GR/N36271/01 'Design for Reliability for Electronics in Automotive Manufacture. RAE_import_type : Journal article RAE_uoa_type : General Engineering

PY - 2007/5/1

Y1 - 2007/5/1

N2 - A novel on-line monitoring technique for integrated MEMS is presented based on injection of an electrical test stimulus into the bias structure through both superposition or modulation. The techniques “bias superposition and bias modulation” both support integrated structural test that targets both production test and on-line condition monitoring through generation of dependability metric. It can in some cases be used to provide the raw data for on-line calibration and compensation. The techniques are demonstrated on three integrated MEMS structures from the field of consumer electronics, aerospace and environmental sensing and have been successfully applied to a thick film conductance sensor.

AB - A novel on-line monitoring technique for integrated MEMS is presented based on injection of an electrical test stimulus into the bias structure through both superposition or modulation. The techniques “bias superposition and bias modulation” both support integrated structural test that targets both production test and on-line condition monitoring through generation of dependability metric. It can in some cases be used to provide the raw data for on-line calibration and compensation. The techniques are demonstrated on three integrated MEMS structures from the field of consumer electronics, aerospace and environmental sensing and have been successfully applied to a thick film conductance sensor.

KW - Sensors

KW - On-line monitoring

KW - Condition monitoring

KW - Design for Testability

KW - Test

KW - MEMS

U2 - 10.1016/j.sna.2006.11.030

DO - 10.1016/j.sna.2006.11.030

M3 - Journal article

VL - 136

SP - 441

EP - 455

JO - Sensors and Actuators A: Physical

JF - Sensors and Actuators A: Physical

SN - 0924-4247

IS - 1

ER -

Research

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