Home > Research > Publications & Outputs > The Fabrication of MMC Electronic Packages usin...

Associated organisational unit

View graph of relations

The Fabrication of MMC Electronic Packages using Thin Shell Electroformed (TSE) EDM Electrodes

Research output: Contribution to conferenceConference paper


Publication date10/2001
Number of pages0
<mark>Original language</mark>English


ConferenceEAST-Forum 2001: Electrodeposition in Electronics (European Academy of Surface Technology)
CityChalkidiki - Ouranoupolis


Metal matrix Composite (MMC) materials are finding increasing use within the electronics packaging industry due to their excellent CTE, stiffness and thermal management properties. One in particular, a spray formed aluminium/silicon composite, can be compositionally modulated to achieve thermal matching to the electronic materials currently in use. One problem with using these materials lies in their specialised machining requirements - the use of very sharp carbide tools which blunt quickly. An alternative approach has been developed that makes use of thin shell (≤ 1.0 mm) electroforms that can be used as electrical discharge machining electrodes to machine the packages. The technology of TSE is described together with measurements of packages produced by this novel technique.