TY - CONF

T1 - The Fabrication of MMC Electronic Packages using Thin Shell Electroformed (TSE) EDM Electrodes

AU - Bocking, C.

AU - Jacobson, D.M

AU - Rennie, Allan

AU - Bennett, G.

PY - 2001/10

Y1 - 2001/10

N2 - Metal matrix Composite (MMC) materials are finding increasing use within the electronics packaging industry due to their excellent CTE, stiffness and thermal management properties. One in particular, a spray formed aluminium/silicon composite, can be compositionally modulated to achieve thermal matching to the electronic materials currently in use. One problem with using these materials lies in their specialised machining requirements - the use of very sharp carbide tools which blunt quickly. An alternative approach has been developed that makes use of thin shell (≤ 1.0 mm) electroforms that can be used as electrical discharge machining electrodes to machine the packages. The technology of TSE is described together with measurements of packages produced by this novel technique.

AB - Metal matrix Composite (MMC) materials are finding increasing use within the electronics packaging industry due to their excellent CTE, stiffness and thermal management properties. One in particular, a spray formed aluminium/silicon composite, can be compositionally modulated to achieve thermal matching to the electronic materials currently in use. One problem with using these materials lies in their specialised machining requirements - the use of very sharp carbide tools which blunt quickly. An alternative approach has been developed that makes use of thin shell (≤ 1.0 mm) electroforms that can be used as electrical discharge machining electrodes to machine the packages. The technology of TSE is described together with measurements of packages produced by this novel technique.

M3 - Conference paper

T2 - EAST-Forum 2001: Electrodeposition in Electronics (European Academy of Surface Technology)

Y2 - 10 October 2001 through 13 October 2001

ER -