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Towards a health monitor for system in package with MEMS functionality.

Research output: Contribution to conference - Without ISBN/ISSN › Conference paper › peer-review

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Towards a health monitor for system in package with MEMS functionality. / Dumas, Norbert; Richardson, Andrew.
2006. Paper presented at 12th IEEE international mixed signal workshop, Edinburgh, United Kingdom.

Research output: Contribution to conference - Without ISBN/ISSN › Conference paper › peer-review

Harvard

Dumas, N & Richardson, A 2006, 'Towards a health monitor for system in package with MEMS functionality.', Paper presented at 12th IEEE international mixed signal workshop, Edinburgh, United Kingdom, 21/01/06 - 23/01/06.

APA

Dumas, N., & Richardson, A. (2006). Towards a health monitor for system in package with MEMS functionality.. Paper presented at 12th IEEE international mixed signal workshop, Edinburgh, United Kingdom.

Vancouver

Dumas N, Richardson A. Towards a health monitor for system in package with MEMS functionality.. 2006. Paper presented at 12th IEEE international mixed signal workshop, Edinburgh, United Kingdom.

Author

Dumas, Norbert ; Richardson, Andrew. / Towards a health monitor for system in package with MEMS functionality. Paper presented at 12th IEEE international mixed signal workshop, Edinburgh, United Kingdom.6 p.

Bibtex

@conference{afefd835d8214f3d882ff789b007363d,
title = "Towards a health monitor for system in package with MEMS functionality.",
abstract = "This paper introduces a preliminary study about using a health monitor (HM) to contribute towards production and on-line testing of System in Package (SiP) that contain MEMS functions. The HM serves as a central unit for the test of both the structure and critical functions within the SiP. The study includes the review of existing test solution which could be in-tegrated in the HM and some initial ideas to test the MEMS functions as typically, BIST is not normally supported by these devices. A SiP RF transceiver is used as a case study. An evaluation of the feasibility of implementing a HM for testing a MEMS switch is presented. Preliminary simulation results obtained by superimposing a low frequency signal into the bias of the switch are encouraging.",
keywords = "System in Package, Test, Health Monitor, MEMS testing.",
author = "Norbert Dumas and Andrew Richardson",
year = "2006",
month = jun,
language = "English",
note = "12th IEEE international mixed signal workshop ; Conference date: 21-01-2006 Through 23-01-2006",

}

RIS

TY - CONF

T1 - Towards a health monitor for system in package with MEMS functionality.

AU - Dumas, Norbert

AU - Richardson, Andrew

PY - 2006/6

Y1 - 2006/6

N2 - This paper introduces a preliminary study about using a health monitor (HM) to contribute towards production and on-line testing of System in Package (SiP) that contain MEMS functions. The HM serves as a central unit for the test of both the structure and critical functions within the SiP. The study includes the review of existing test solution which could be in-tegrated in the HM and some initial ideas to test the MEMS functions as typically, BIST is not normally supported by these devices. A SiP RF transceiver is used as a case study. An evaluation of the feasibility of implementing a HM for testing a MEMS switch is presented. Preliminary simulation results obtained by superimposing a low frequency signal into the bias of the switch are encouraging.

AB - This paper introduces a preliminary study about using a health monitor (HM) to contribute towards production and on-line testing of System in Package (SiP) that contain MEMS functions. The HM serves as a central unit for the test of both the structure and critical functions within the SiP. The study includes the review of existing test solution which could be in-tegrated in the HM and some initial ideas to test the MEMS functions as typically, BIST is not normally supported by these devices. A SiP RF transceiver is used as a case study. An evaluation of the feasibility of implementing a HM for testing a MEMS switch is presented. Preliminary simulation results obtained by superimposing a low frequency signal into the bias of the switch are encouraging.

KW - System in Package

KW - Test

KW - Health Monitor

KW - MEMS testing.

M3 - Conference paper

T2 - 12th IEEE international mixed signal workshop

Y2 - 21 January 2006 through 23 January 2006

ER -