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  1. Chapter
  2. Published

    Exploration of Through Silicon Via Interconnect Parasitics for 3-Dimensional Integrated Circuits

    Grange, M., Weerasekera, R., Pamunuwa, D. & Tenhunen, H., 2009, Workshop Notes, Design, Automation and Test in Europe (DATE). Nice

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

  3. Published

    Bandwidth optimization for through silicon via (TSV) bundles in 3D integrated circuits.

    Weldezion, A., Weerasekera, R., Pamunuwa, D. B., Zheng, L-R. & Tenhunen, H., 2009, Workshop Notes, Design, Automation and Test in Europe (DATE). Nice

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

  4. Published

    Three-dimensional Modeling of Stress Transfer, Stiffness Degradation, failure and Transverse Cracking in Composite Laminates.

    Ye, J., 2009, Advances in Engineering Mechanics. Qin, Q. & Sun, B. (eds.). Nova Science Publishers, Vol. 1. p. 127-165 39 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

  5. Published

    Reducing the Computational Complexity of an RLS-Based Adaptive Controller in ANVC Applications

    Montazeri, A. & Poshtan, J., 2009, Advances in Computer Science and Engineering: 13th International CSI Computer Conference, CSICC 2008 Kish Island, Iran, March 9-11, 2008 Revised Selected Papers. Sarbazi-Azad, H., Parhami, B., Miremadi, S-G. & Hessabi, S. (eds.). Berlin: SPRINGER-VERLAG BERLIN, p. 259-266 8 p. (COMMUNICATIONS IN COMPUTER AND INFORMATION SCIENCE; vol. 6).

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

  6. Published

    Acoustic system for online wiring test on aircraft.

    Xu, Z., Koltsov, D., Richardson, A. & Sutherland, A., 18/06/2008, IEEE 14th International Mixed-Signals, Sensors, and Systems Test Workshop, 2008. IMS3TW 2008.. IEEE, p. 1-4 4 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

  7. Published

    Memory technology for extended large-scale integration in future electronics applications.

    Pamunuwa, D. B., 03/2008, Proc. Design, Automation and Test in Europe (DATE) Conference. Munich: IEEE, p. 1126-1127 2 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

  8. Published

    RFID and NFC on Mobile Phones.

    Coulton, P., Rashid, O. & Edwards, R., 03/2008, RFID Handbook: Applications, Technology, Security and Privacy. Ahson, S. & Ilyas, M. (eds.). CRC Press, p. 375-391 17 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

  9. Published

    Extending systems-on-chip to the third dimension : performance, cost and technological tradeoffs.

    Weerasekera, R., Zheng, L-R., Pamunuwa, D. B. & Tenhunen, H., 11/2007, Proc. IEEE/ACM International Conference on Computer-Aided Design (ICCAD). San Jose, California: IEEE, p. 212-219 8 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

  10. Published

    Early selection of system implementation choice among SoC, SoP and 3-D integration.

    Weerasekera, R., Zheng, L-R., Pamunuwa, D. B. & Tenhunen, H., 09/2007, Proc. International System-On-Chip Conference (SOCC). Hsin Chu, Taiwan: IEEE

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

  11. Published

    Molecular electronics device modeling for system design.

    Lei, C., Pamunuwa, D. B., Bailey, S. & Lambert, C., 08/2007, Proc. IEEE International Conference on Nanotechnology. Hong Kong: IEEE, p. 1116-1119 4 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

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