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Juan Montalvan Lume

  • Lancaster Institute for the Contemporary Arts
Type of address: Postal address.
Lancaster University
The LICA Building
LA1 4YW
Lancaster

Email: j.montalvanlume@lancaster.ac.uk

Web address: https://pupc.academia.edu/jgmontalvan

Qualifications

MSc, Industrial Design (Human-Robot Interaction), Korea Advanced Institute of Science and Technology (KAIST)

1/09/201419/08/2016

Award Date: 19/08/2016

BA, Industrial Design, Pontifical Catholic University of Peru (PUCP)

12/03/200715/12/2011

Award Date: 10/04/2012

Employment

PhD, (Co)Designing Nature-societies

Lancaster Institute for the Contemporary Arts

Lancaster University

Lancaster, United Kingdom

Supervised by: Suzana Ilic, Serena Pollastri, Louise Elisabeth Mullagh

1/10/2023 → present

International Advisory Council Member

The Design Research Society

10/05/2020 → …

Head of the Space Design Division

Center for Space Emerging Technologies (C-SET)

Canada

5/03/2020 → …

Lecturer

Pontifical Catholic University of Peru (PUCP)

Peru

10/02/2017 → …

Research outputs

Design of Biomedical Soft Robotic Device for Lower Limbs Mechanical Muscle Rehabilitation and Electrochemical Monitoring under Reduced-Gravity Space Environment

Ticllacuri, V., Cornejo, J., Castrejon, N., Diaz, A. B., Hinostroza, K., Dev, D., Chen, Y. K., Palacios, P., Castillo, W., Vargas, M., Cornejo-Aguilar, J. A., Montalvan, J. & Roman-Gonzalez, A., 24/11/2021, 2021 IEEE URUCON, URUCON 2021. Institute of Electrical and Electronics Engineers Inc., p. 227-231 5 p. (2021 IEEE URUCON, URUCON 2021).

Guía de Investigación en Diseño

Montalvan Lume, J., Soria Morales, C., Hopkins Barriga, A., Ascue Yendo, R. & Ajito Lam, E., 20/12/2019, First ed. Pontificia Universidad Católica del Perú. 112 p. (Pontificia Universidad católica del Perú)

Adaptation profiles in first-time robot users: Towards understanding adaptation patterns and their implications for design

Montalván, J., Shin, H., Cuéllar, F. & Lee, K., 30/04/2017, In: International Journal of Design. 11, 1, p. 1-19 19 p.