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  1. Published

    Fabrication of multilayered SU8 structure for terahertz waveguide with ultralow transmission loss

    Tian, Y., Shang, X. & Lancaster, M. J., 01/2014, In: Journal of Micro/Nanolithography, MEMS, and MOEMS. 13, 1, 6 p., 013002.

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

  2. Published

    High density indium bumping using electrodeposition enhanced by megasonic agitation

    Tian, Y., Liu, C., Hutt, D., Stevens, B., Flynn, D. & Desmulliez, M. P. Y., 2009, Electronics Packaging Technology Conference, 2009. EPTC '09. 11th. IEEE, p. 31-35 5 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

  3. Published

    Megasonic enhanced wafer bumping process to enable high density electronics interconnection

    Tian, Y., Kaufmann, J., Liu, C., Hutt, D. A., Stevens, B. & Desmulliez, M. P. Y., 2008, Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd. IEEE, p. 725-729 5 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

  4. Published

    High density indium bumping through pulse plating used for pixel X-ray detectors

    Tian, Y., Hutt, D. A., Liu, C. & Stevens, B., 10/08/2009, Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. IEEE, p. 456-460 5 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

  5. Published

    Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation

    Tian, Y., Liu, C., Hutt, D., Stevens, B., Flynn, D. & Desmulliez, M. P. Y., 2011, Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. IEEE, p. 739-744 6 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

  6. Published

    A Distributed Position-Based Protocol for Emergency Messages Broadcasting in Vehicular Ad Hoc Networks

    Tian, D., Liu, C., Duan, X., Sheng, Z., Ni, Q., Chen, M. & Leung, V. C. M., 10/04/2018, In: IEEE Internet of Things Journal. 5, 2, p. 1218-1227 10 p.

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

  7. Published

    Optimal Epidemic Information Dissemination in Uncertain Dynamic Environment

    Tian, D., Dai, Z., Zhou, J., Duan, X., Sheng, Z., Chen, M., Ni, Q. & Leung, V. C. M., 08/2018, In: IEEE Wireless Communications Letters. 7, 4, p. 518-521 4 p.

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

  8. Published

    Cooperative Content Transmission for Vehicular Ad Hoc Networks using Robust Optimization

    Tian, D., Zhou, J., Chen, M., Sheng, Z., Ni, Q. & Leung, V. C. M., 2018, IEEE INFOCOM 2018 - IEEE Conference on Computer Communications. IEEE, p. 90-98 9 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

  9. Published

    A Review on Laser Powder Bed Fusion of Inconel 625 Nickel-Based Alloy

    Tian, Z., Zhang, C., Wang, D., Liu, W., Fang, X., Wellmann, D., Zhao, Y. & Tian, Y., 20/12/2019, In: Applied Sciences. 10, 1, 14 p., 81.

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

  10. Published

    Improved Model for Beam-Wave Interaction with Ohmic Losses and Reflections of Sheet Beam Traveling Wave Tubes

    Tian, H., Shi, N., Wang, Z., Wang, S., Duan, Z., Gong, H., Lu, Z., Paoloni, C., Feng, J. & Gong, Y., 30/06/2021, In: IEEE Transactions on Electron Devices. 68, 6, p. 2977-2983 7 p.

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

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