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Modelling the behaviour of soldier joints for w...
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School of Engineering
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Engineering of Microwaves, Terahertz and Light (E-MIT)
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Modelling the behaviour of soldier joints for wafer level SIP.
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Contribution in Book/Report/Proceedings - With ISBN/ISSN
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Overview
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Hongyuan Liu
N. Strusevich
S. Stoyanov
C. Bailey
Andrew M. D. Richardson
N. Dumas
J. M. Yannou
V. Georgel
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Publication date
2006
Host publication
Proceedings of the 8th IEEE electronics packaging technology conference.
<mark>Original language</mark>
English