Standard
Harvard
Liu, H, Strusevich, N, Stoyanov, S, Bailey, C
, Richardson, AMD, Dumas, N, Yannou, JM & Georgel, V 2006,
Modelling the behaviour of soldier joints for wafer level SIP. in
Proceedings of the 8th IEEE electronics packaging technology conference..
APA
Liu, H., Strusevich, N., Stoyanov, S., Bailey, C.
, Richardson, A. M. D., Dumas, N., Yannou, J. M., & Georgel, V. (2006).
Modelling the behaviour of soldier joints for wafer level SIP. In
Proceedings of the 8th IEEE electronics packaging technology conference.
Vancouver
Author
Bibtex
@inbook{b8cf750a268b411aae47b5c0f6722186,
title = "Modelling the behaviour of soldier joints for wafer level SIP.",
author = "Hongyuan Liu and N. Strusevich and S. Stoyanov and C. Bailey and Richardson, {Andrew M. D.} and N. Dumas and Yannou, {J. M.} and V. Georgel",
year = "2006",
language = "English",
booktitle = "Proceedings of the 8th IEEE electronics packaging technology conference.",
}
RIS
TY - CHAP
T1 - Modelling the behaviour of soldier joints for wafer level SIP.
AU - Liu, Hongyuan
AU - Strusevich, N.
AU - Stoyanov, S.
AU - Bailey, C.
AU - Richardson, Andrew M. D.
AU - Dumas, N.
AU - Yannou, J. M.
AU - Georgel, V.
PY - 2006
Y1 - 2006
M3 - Chapter
BT - Proceedings of the 8th IEEE electronics packaging technology conference.
ER -