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Modelling the behaviour of soldier joints for wafer level SIP.

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

Published

Standard

Modelling the behaviour of soldier joints for wafer level SIP. / Liu, Hongyuan; Strusevich, N.; Stoyanov, S.; Bailey, C.; Richardson, Andrew M. D.; Dumas, N.; Yannou, J. M.; Georgel, V.

Proceedings of the 8th IEEE electronics packaging technology conference.. 2006.

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

Harvard

Liu, H, Strusevich, N, Stoyanov, S, Bailey, C, Richardson, AMD, Dumas, N, Yannou, JM & Georgel, V 2006, Modelling the behaviour of soldier joints for wafer level SIP. in Proceedings of the 8th IEEE electronics packaging technology conference..

APA

Liu, H., Strusevich, N., Stoyanov, S., Bailey, C., Richardson, A. M. D., Dumas, N., Yannou, J. M., & Georgel, V. (2006). Modelling the behaviour of soldier joints for wafer level SIP. In Proceedings of the 8th IEEE electronics packaging technology conference.

Vancouver

Liu H, Strusevich N, Stoyanov S, Bailey C, Richardson AMD, Dumas N et al. Modelling the behaviour of soldier joints for wafer level SIP. In Proceedings of the 8th IEEE electronics packaging technology conference.. 2006

Author

Liu, Hongyuan ; Strusevich, N. ; Stoyanov, S. ; Bailey, C. ; Richardson, Andrew M. D. ; Dumas, N. ; Yannou, J. M. ; Georgel, V. / Modelling the behaviour of soldier joints for wafer level SIP. Proceedings of the 8th IEEE electronics packaging technology conference.. 2006.

Bibtex

@inbook{b8cf750a268b411aae47b5c0f6722186,
title = "Modelling the behaviour of soldier joints for wafer level SIP.",
author = "Hongyuan Liu and N. Strusevich and S. Stoyanov and C. Bailey and Richardson, {Andrew M. D.} and N. Dumas and Yannou, {J. M.} and V. Georgel",
year = "2006",
language = "English",
booktitle = "Proceedings of the 8th IEEE electronics packaging technology conference.",

}

RIS

TY - CHAP

T1 - Modelling the behaviour of soldier joints for wafer level SIP.

AU - Liu, Hongyuan

AU - Strusevich, N.

AU - Stoyanov, S.

AU - Bailey, C.

AU - Richardson, Andrew M. D.

AU - Dumas, N.

AU - Yannou, J. M.

AU - Georgel, V.

PY - 2006

Y1 - 2006

M3 - Chapter

BT - Proceedings of the 8th IEEE electronics packaging technology conference.

ER -