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Using bias superposition to test a thick film conductance sensor.

Research output: Contribution to journalJournal article

Published

Associated organisational unit

Journal publication date2005
JournalJournal of Physics: Conference Series
Volume15
Number of pages6
Pages161-166
Original languageEnglish

Abstract

A novel on-line monitoring technique for a range of MEMS and integrated sensor systems is presented based on the injection of a test stimuli into the bias structure of transducer functions. The technique `Bias Superposition' utilises both signal injection and signal extraction techniques to achieve an indication of structural integrity of the transducer and interface. The technique has been successfully applied to a thick film conductance sensor.

Bibliographic note

Proceedings of the Sensors and their Applications XIII Conference.