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Using bias superposition to test a thick film conductance sensor.

Research output: Contribution to journalJournal article


Associated organisational unit

<mark>Journal publication date</mark>2005
<mark>Journal</mark>Journal of Physics: Conference Series
Number of pages6
<mark>Original language</mark>English


A novel on-line monitoring technique for a range of MEMS and integrated sensor systems is presented based on the injection of a test stimuli into the bias structure of transducer functions. The technique `Bias Superposition' utilises both signal injection and signal extraction techniques to achieve an indication of structural integrity of the transducer and interface. The technique has been successfully applied to a thick film conductance sensor.

Bibliographic note

Proceedings of the Sensors and their Applications XIII Conference.