Results for Electroplating

Publications & Outputs

1. Electrodeposition of indium bumps for ultrafine pitch interconnection

   Tian, Y., Liu, C., Hutt, D. & Stevens, B., 02/2014, In: Journal of Electronic Materials. 43, 2, p. 594-603 10 p.

   Research output: Contribution to Journal/Magazine › Journal article › peer-review