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Electrodeposition of indium bumps for ultrafine pitch interconnection

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<mark>Journal publication date</mark>02/2014
<mark>Journal</mark>Journal of Electronic Materials
Issue number2
Volume43
Number of pages10
Pages (from-to)594-603
Publication StatusPublished
Early online date21/11/13
<mark>Original language</mark>English

Abstract

Electroplating is a promising method to produce ultrafine pitch indium bumps for assembly of pixel detectors in imaging applications. In this work, the process of indium bumping through electrodeposition was demonstrated and the influences of various current waveforms on the bump morphology, microstructure and height uniformity were investigated. Electron microscopy was used to study the microstructure of electroplated indium bumps and a Zygo white light interferometer was utilised to evaluate the height uniformity. The results indicated that the bump uniformities on wafer, pattern and feature scales were improved by using unipolar pulse and bipolar pulse reverse current waveforms.