Wun, T., Oehlberg, L.,
Sturdee, M. & Carpendale, S.,
17/03/2019,
TEI 2019 - Proceedings of the 13th International Conference on Tangible, Embedded, and Embodied Interaction. New York:
ACM,
p. 297-306 10 p. (TEI 2019 - Proceedings of the 13th International Conference on Tangible, Embedded, and Embodied Interaction).
Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review