• Published

  On signalling over through-silicon via (TSV) interconnects in 3-D integrated circuits.

  Weerasekera, R., Grange, M., Pamunuwa, D. B. & Tenhunen, H., 03/2010, p. 1325-1328. 4 p.

  Research output: Contribution to conference - Without ISBN/ISSN › Conference paper › peer-review

• Published

  Compact modelling of through-silicon vias (TSVs) in three-dimensional (3-D) integrated circuits.

  Weerasekera, R., Grange, M., Pamunuwa, D. B., Tenhunen, H. & Zheng, L.-R., 10/2009, Proceedings of the IEEE International Conference on 3D System Integration (3D IC), 2009. San Francisco: IEEE

  Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

• Published

  2-D and 3-D Integration of Heterogeneous Electronic Systems under Cost, Performance and Technological Constraints

  Weerasekera, R., Pamunuwa, D., Zheng, L.-R. & Tenhunen, H., 08/2009, In: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 28, 8, p. 1237-1250 14 p.

  Research output: Contribution to Journal/Magazine › Journal article

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