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Applications of mixed signal test strategies to next generation microsystems.

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

Published

Standard

Applications of mixed signal test strategies to next generation microsystems. / Jeffery, C.; Rosing, R.; Richardson, A. M. D.
Design, modeling, and simulation in microelectronics. 4228. ed. SPIE (Society of Photo-Optical Instrumentation Engineers), 2000. p. 21-32.

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

Harvard

Jeffery, C, Rosing, R & Richardson, AMD 2000, Applications of mixed signal test strategies to next generation microsystems. in Design, modeling, and simulation in microelectronics. 4228 edn, SPIE (Society of Photo-Optical Instrumentation Engineers), pp. 21-32.

APA

Jeffery, C., Rosing, R., & Richardson, A. M. D. (2000). Applications of mixed signal test strategies to next generation microsystems. In Design, modeling, and simulation in microelectronics (4228 ed., pp. 21-32). SPIE (Society of Photo-Optical Instrumentation Engineers).

Vancouver

Jeffery C, Rosing R, Richardson AMD. Applications of mixed signal test strategies to next generation microsystems. In Design, modeling, and simulation in microelectronics. 4228 ed. SPIE (Society of Photo-Optical Instrumentation Engineers). 2000. p. 21-32

Author

Jeffery, C. ; Rosing, R. ; Richardson, A. M. D. / Applications of mixed signal test strategies to next generation microsystems. Design, modeling, and simulation in microelectronics. 4228. ed. SPIE (Society of Photo-Optical Instrumentation Engineers), 2000. pp. 21-32

Bibtex

@inbook{57f241f15dfb496abac53cb9fd9e3830,
title = "Applications of mixed signal test strategies to next generation microsystems.",
abstract = "Improvements in test technology for next generation microsystems is now becoming essential, especially in sensing applications as in most cases, each sensor has a unique set of characteristics causing inevitable difficulties associated with calibration and validation. Ideally, a microsystem should generate a calibrated output and a reliability indicator. IEEE1451.2 has been developed to provide a standard interface yet research into methods of providing these features through Built-In Self-Test (BIST) and On-line monitoring (OLM) techniques is still needed. One of the current industrial techniques uses multiple sensors to determine faults allowing systems to be temporarily reconfigured until the problems are resolved. This technique is only economical if multiple sensors with a strong functional correlation are present within the original system. In case only one sensor is present, using redundancies within this sensor would be more economical than adding extra sensors for test purposes. The aim of this paper is to review generic properties of sensor systems to identify areas where mixed signal testing techniques could be adapted for sensor test and to identify areas for further research.",
keywords = "Integrated circuit, Test method, Built in self test, Redundancy, Electromechanical device",
author = "C. Jeffery and R. Rosing and Richardson, {A. M. D.}",
note = "Design, modeling, and simulation in microelectronics (Conference) (2000 Nov : Singapore)",
year = "2000",
language = "English",
isbn = "0-8194-3900-2.",
pages = "21--32",
booktitle = "Design, modeling, and simulation in microelectronics",
publisher = "SPIE (Society of Photo-Optical Instrumentation Engineers)",
edition = "4228",

}

RIS

TY - CHAP

T1 - Applications of mixed signal test strategies to next generation microsystems.

AU - Jeffery, C.

AU - Rosing, R.

AU - Richardson, A. M. D.

N1 - Design, modeling, and simulation in microelectronics (Conference) (2000 Nov : Singapore)

PY - 2000

Y1 - 2000

N2 - Improvements in test technology for next generation microsystems is now becoming essential, especially in sensing applications as in most cases, each sensor has a unique set of characteristics causing inevitable difficulties associated with calibration and validation. Ideally, a microsystem should generate a calibrated output and a reliability indicator. IEEE1451.2 has been developed to provide a standard interface yet research into methods of providing these features through Built-In Self-Test (BIST) and On-line monitoring (OLM) techniques is still needed. One of the current industrial techniques uses multiple sensors to determine faults allowing systems to be temporarily reconfigured until the problems are resolved. This technique is only economical if multiple sensors with a strong functional correlation are present within the original system. In case only one sensor is present, using redundancies within this sensor would be more economical than adding extra sensors for test purposes. The aim of this paper is to review generic properties of sensor systems to identify areas where mixed signal testing techniques could be adapted for sensor test and to identify areas for further research.

AB - Improvements in test technology for next generation microsystems is now becoming essential, especially in sensing applications as in most cases, each sensor has a unique set of characteristics causing inevitable difficulties associated with calibration and validation. Ideally, a microsystem should generate a calibrated output and a reliability indicator. IEEE1451.2 has been developed to provide a standard interface yet research into methods of providing these features through Built-In Self-Test (BIST) and On-line monitoring (OLM) techniques is still needed. One of the current industrial techniques uses multiple sensors to determine faults allowing systems to be temporarily reconfigured until the problems are resolved. This technique is only economical if multiple sensors with a strong functional correlation are present within the original system. In case only one sensor is present, using redundancies within this sensor would be more economical than adding extra sensors for test purposes. The aim of this paper is to review generic properties of sensor systems to identify areas where mixed signal testing techniques could be adapted for sensor test and to identify areas for further research.

KW - Integrated circuit

KW - Test method

KW - Built in self test

KW - Redundancy

KW - Electromechanical device

M3 - Chapter

SN - 0-8194-3900-2.

SP - 21

EP - 32

BT - Design, modeling, and simulation in microelectronics

PB - SPIE (Society of Photo-Optical Instrumentation Engineers)

ER -