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Characteristics and durability of fluoropolymer thin films

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Characteristics and durability of fluoropolymer thin films. / Cheneler, David; Bowen, James; Evans, Stephen D. et al.
In: Polymer Degradation and Stability, Vol. 96, No. 4, 04.2011, p. 561-565.

Research output: Contribution to Journal/Magazine › Journal article › peer-review

Harvard

Cheneler, D, Bowen, J, Evans, SD, Górzny, M, Adams, MJ & Ward, MCL 2011, 'Characteristics and durability of fluoropolymer thin films', Polymer Degradation and Stability, vol. 96, no. 4, pp. 561-565. https://doi.org/10.1016/j.polymdegradstab.2010.12.022

APA

Cheneler, D., Bowen, J., Evans, S. D., Górzny, M., Adams, M. J., & Ward, M. C. L. (2011). Characteristics and durability of fluoropolymer thin films. Polymer Degradation and Stability, 96(4), 561-565. https://doi.org/10.1016/j.polymdegradstab.2010.12.022

Vancouver

Cheneler D, Bowen J, Evans SD, Górzny M, Adams MJ, Ward MCL. Characteristics and durability of fluoropolymer thin films. Polymer Degradation and Stability. 2011 Apr;96(4):561-565. doi: 10.1016/j.polymdegradstab.2010.12.022

Author

Cheneler, David ; Bowen, James ; Evans, Stephen D. et al. / Characteristics and durability of fluoropolymer thin films. In: Polymer Degradation and Stability. 2011 ; Vol. 96, No. 4. pp. 561-565.

Bibtex

@article{aac352ec0fe64d109c6a76d0b340b17f,
title = "Characteristics and durability of fluoropolymer thin films",
abstract = "The use of plasma-polymerised fluoropolymer (CFxOy) thin films in the manufacture of microelectromechanical systems (MEMS) devices is well-established, being employed in the passivation step of the deep reactive ion etching (DRIE) process, for example. This paper presents an investigation of the effect of exposure to organic and aqueous liquid media on plasma-polymerised CFxOy thin films. Atomic force microscopy (AFM), scanning electron microscopy (SEM), ellipsometry, X-ray photoelectron spectroscopy (XPS) and dynamic wetting measurements were all employed as characterisation techniques. Highly basic aqueous solutions, including known silicon etchants, were found to cause delamination via degradation of the countersurface below the CFxOy thin film. Films were found to be stable in organic solvents, acidic aqueous solutions and slightly basic aqueous solutions.",
keywords = "Fluoropolymer, Atomic force microscopy , X-ray photoelectron spectroscopy , Wetting , Etchant , pH",
author = "David Cheneler and James Bowen and Evans, {Stephen D.} and Marcin G{\'o}rzny and Adams, {Michael J.} and Ward, {Michael C. L.}",
year = "2011",
month = apr,
doi = "10.1016/j.polymdegradstab.2010.12.022",
language = "English",
volume = "96",
pages = "561--565",
journal = "Polymer Degradation and Stability",
issn = "0141-3910",
publisher = "Elsevier Limited",
number = "4",

}

RIS

TY - JOUR

T1 - Characteristics and durability of fluoropolymer thin films

AU - Cheneler, David

AU - Bowen, James

AU - Evans, Stephen D.

AU - Górzny, Marcin

AU - Adams, Michael J.

AU - Ward, Michael C. L.

PY - 2011/4

Y1 - 2011/4

N2 - The use of plasma-polymerised fluoropolymer (CFxOy) thin films in the manufacture of microelectromechanical systems (MEMS) devices is well-established, being employed in the passivation step of the deep reactive ion etching (DRIE) process, for example. This paper presents an investigation of the effect of exposure to organic and aqueous liquid media on plasma-polymerised CFxOy thin films. Atomic force microscopy (AFM), scanning electron microscopy (SEM), ellipsometry, X-ray photoelectron spectroscopy (XPS) and dynamic wetting measurements were all employed as characterisation techniques. Highly basic aqueous solutions, including known silicon etchants, were found to cause delamination via degradation of the countersurface below the CFxOy thin film. Films were found to be stable in organic solvents, acidic aqueous solutions and slightly basic aqueous solutions.

AB - The use of plasma-polymerised fluoropolymer (CFxOy) thin films in the manufacture of microelectromechanical systems (MEMS) devices is well-established, being employed in the passivation step of the deep reactive ion etching (DRIE) process, for example. This paper presents an investigation of the effect of exposure to organic and aqueous liquid media on plasma-polymerised CFxOy thin films. Atomic force microscopy (AFM), scanning electron microscopy (SEM), ellipsometry, X-ray photoelectron spectroscopy (XPS) and dynamic wetting measurements were all employed as characterisation techniques. Highly basic aqueous solutions, including known silicon etchants, were found to cause delamination via degradation of the countersurface below the CFxOy thin film. Films were found to be stable in organic solvents, acidic aqueous solutions and slightly basic aqueous solutions.

KW - Fluoropolymer

KW - Atomic force microscopy

KW - X-ray photoelectron spectroscopy

KW - Wetting

KW - Etchant

KW - pH

U2 - 10.1016/j.polymdegradstab.2010.12.022

DO - 10.1016/j.polymdegradstab.2010.12.022

M3 - Journal article

VL - 96

SP - 561

EP - 565

JO - Polymer Degradation and Stability

JF - Polymer Degradation and Stability

SN - 0141-3910

IS - 4

ER -