Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review
Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review
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TY - GEN
T1 - Compact microstrip feedings with an elevated ground plane for thick folded SIW
AU - Wang, Lei
AU - Wu, Qi
AU - Mosig, Juan R.
PY - 2016/9/22
Y1 - 2016/9/22
N2 - Folded substrate integrated waveguide (FSIW) has been proposed for further size reduction, while keeping the advantages of traditional SIW. FSIW-based horn antennas are very promising in millimeter wave applications. To improve the bandwidth and efficiency of such antennas, a thick substrate is preferred but the microstrip feeding line becomes unacceptly wide to obtain a reasonable impedance. This paper introduces compact microstrip feeding lines with elevated ground plane for thick FSIW. Arbitrary characteristic impedance can be achieved without increasing the width of the feeding line, which will be very useful for the integration with other millimeter circuit components.
AB - Folded substrate integrated waveguide (FSIW) has been proposed for further size reduction, while keeping the advantages of traditional SIW. FSIW-based horn antennas are very promising in millimeter wave applications. To improve the bandwidth and efficiency of such antennas, a thick substrate is preferred but the microstrip feeding line becomes unacceptly wide to obtain a reasonable impedance. This paper introduces compact microstrip feeding lines with elevated ground plane for thick FSIW. Arbitrary characteristic impedance can be achieved without increasing the width of the feeding line, which will be very useful for the integration with other millimeter circuit components.
U2 - 10.1109/URSI-EMTS.2016.7571503
DO - 10.1109/URSI-EMTS.2016.7571503
M3 - Conference contribution/Paper
SN - 9781509025022
BT - 2016 URSI International Symposium on Electromagnetic Theory (EMTS)
PB - IEEE
ER -