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Design and implementation of a planar helix for traveling wave tubes based on package compatible ball grid array technology

Research output: Contribution to Journal/MagazineJournal articlepeer-review

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Design and implementation of a planar helix for traveling wave tubes based on package compatible ball grid array technology. / Babaeihaselghobi, A.; Nadeem Akram, M.; Badri Ghavifekr, H. et al.
In: Microsystem Technologies, Vol. 26, 01.05.2020, p. 1681–1687.

Research output: Contribution to Journal/MagazineJournal articlepeer-review

Harvard

Babaeihaselghobi, A, Nadeem Akram, M, Badri Ghavifekr, H, Billa, LR, Bardalen, E & Ohlckers, PA 2020, 'Design and implementation of a planar helix for traveling wave tubes based on package compatible ball grid array technology', Microsystem Technologies, vol. 26, pp. 1681–1687. https://doi.org/10.1007/s00542-019-04713-8

APA

Babaeihaselghobi, A., Nadeem Akram, M., Badri Ghavifekr, H., Billa, L. R., Bardalen, E., & Ohlckers, P. A. (2020). Design and implementation of a planar helix for traveling wave tubes based on package compatible ball grid array technology. Microsystem Technologies, 26, 1681–1687. https://doi.org/10.1007/s00542-019-04713-8

Vancouver

Babaeihaselghobi A, Nadeem Akram M, Badri Ghavifekr H, Billa LR, Bardalen E, Ohlckers PA. Design and implementation of a planar helix for traveling wave tubes based on package compatible ball grid array technology. Microsystem Technologies. 2020 May 1;26:1681–1687. Epub 2019 Dec 11. doi: 10.1007/s00542-019-04713-8

Author

Babaeihaselghobi, A. ; Nadeem Akram, M. ; Badri Ghavifekr, H. et al. / Design and implementation of a planar helix for traveling wave tubes based on package compatible ball grid array technology. In: Microsystem Technologies. 2020 ; Vol. 26. pp. 1681–1687.

Bibtex

@article{a41c7e5099bc40a6b467e109eec8383e,
title = "Design and implementation of a planar helix for traveling wave tubes based on package compatible ball grid array technology",
abstract = "In this article, a novel planar helix traveling wave tube structure is proposed for S/X-band amplification. The planar helix structure is developed between two printed circuit boards such that they utilize solder balls to connect each other. This technique which comes originally from microelecronic packaging technology called ball grid array. To evaluate the performance of the proposed structure, one period of its geometry is modeled and the cold test parameters are calculated in CST microwave studio TM. The fundamental space harmonic mode overlaps well with the beam-line in the dispersion diagram for both bands. The in- and out-coupler ports are also designed in the form of coplanar waveguides having good matching. For 150 periods of the planar helix, the 15 dB gain is obtained in particle-in-cell simulations for both bands. Finally, the fabrication process is implemented and the cold test is done. ",
author = "A. Babaeihaselghobi and {Nadeem Akram}, M. and {Badri Ghavifekr}, H. and L.R. Billa and E. Bardalen and P.A. Ohlckers",
year = "2020",
month = may,
day = "1",
doi = "10.1007/s00542-019-04713-8",
language = "English",
volume = "26",
pages = "1681–1687",
journal = "Microsystem Technologies",
issn = "0946-7076",
publisher = "Springer Verlag",

}

RIS

TY - JOUR

T1 - Design and implementation of a planar helix for traveling wave tubes based on package compatible ball grid array technology

AU - Babaeihaselghobi, A.

AU - Nadeem Akram, M.

AU - Badri Ghavifekr, H.

AU - Billa, L.R.

AU - Bardalen, E.

AU - Ohlckers, P.A.

PY - 2020/5/1

Y1 - 2020/5/1

N2 - In this article, a novel planar helix traveling wave tube structure is proposed for S/X-band amplification. The planar helix structure is developed between two printed circuit boards such that they utilize solder balls to connect each other. This technique which comes originally from microelecronic packaging technology called ball grid array. To evaluate the performance of the proposed structure, one period of its geometry is modeled and the cold test parameters are calculated in CST microwave studio TM. The fundamental space harmonic mode overlaps well with the beam-line in the dispersion diagram for both bands. The in- and out-coupler ports are also designed in the form of coplanar waveguides having good matching. For 150 periods of the planar helix, the 15 dB gain is obtained in particle-in-cell simulations for both bands. Finally, the fabrication process is implemented and the cold test is done.

AB - In this article, a novel planar helix traveling wave tube structure is proposed for S/X-band amplification. The planar helix structure is developed between two printed circuit boards such that they utilize solder balls to connect each other. This technique which comes originally from microelecronic packaging technology called ball grid array. To evaluate the performance of the proposed structure, one period of its geometry is modeled and the cold test parameters are calculated in CST microwave studio TM. The fundamental space harmonic mode overlaps well with the beam-line in the dispersion diagram for both bands. The in- and out-coupler ports are also designed in the form of coplanar waveguides having good matching. For 150 periods of the planar helix, the 15 dB gain is obtained in particle-in-cell simulations for both bands. Finally, the fabrication process is implemented and the cold test is done.

U2 - 10.1007/s00542-019-04713-8

DO - 10.1007/s00542-019-04713-8

M3 - Journal article

VL - 26

SP - 1681

EP - 1687

JO - Microsystem Technologies

JF - Microsystem Technologies

SN - 0946-7076

ER -