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Direct e-beam lithography of PDMS

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Direct e-beam lithography of PDMS. / Bowen, James; Cheneler, David; Robinson, Alex.
In: Microelectronic Engineering, Vol. 97, 09.2012, p. 34-37.

Research output: Contribution to Journal/MagazineJournal articlepeer-review

Harvard

Bowen, J, Cheneler, D & Robinson, A 2012, 'Direct e-beam lithography of PDMS', Microelectronic Engineering, vol. 97, pp. 34-37. https://doi.org/10.1016/j.mee.2012.02.049

APA

Bowen, J., Cheneler, D., & Robinson, A. (2012). Direct e-beam lithography of PDMS. Microelectronic Engineering, 97, 34-37. https://doi.org/10.1016/j.mee.2012.02.049

Vancouver

Bowen J, Cheneler D, Robinson A. Direct e-beam lithography of PDMS. Microelectronic Engineering. 2012 Sept;97:34-37. doi: 10.1016/j.mee.2012.02.049

Author

Bowen, James ; Cheneler, David ; Robinson, Alex. / Direct e-beam lithography of PDMS. In: Microelectronic Engineering. 2012 ; Vol. 97. pp. 34-37.

Bibtex

@article{2e2b809727e44f7b8994fcca79d4aa77,
title = "Direct e-beam lithography of PDMS",
abstract = "In this paper, the viability of directly exposing thin films of liquid poly(dimethylsiloxane) (PDMS) to electron beam (e-beam) irradiation using e-beam lithographic methods for the purpose of creating permanent micro-scale components has been investigated. By exposing 1.1 μm thickness PDMS films to doses in the range 10–50,000 μC/cm2, it was discovered that the structure of the resultant film exhibits four distinct phases, depending upon the exposure dose. These phases were manifested in both the resultant Young{\textquoteright}s modulus and thickness of the developed film. It was found that there is a critical dose whereupon the resultant film undergoes solidification and adheres to the counter surface sufficiently to survive the development process. It has been shown that the Young{\textquoteright}s modulus of the solid film can be varied over seven orders of magnitude, from that of a viscoelastic material through a rubbery regime to that of a glassy one, by increasing the e-beam dose. At higher doses, excessive backscattering was observed, as well as film swelling, resulting in poor spatial resolution.",
keywords = "e-Beam, Lithography, PDMS, Poly(dimethylsiloxane)",
author = "James Bowen and David Cheneler and Alex Robinson",
year = "2012",
month = sep,
doi = "10.1016/j.mee.2012.02.049",
language = "English",
volume = "97",
pages = "34--37",
journal = "Microelectronic Engineering",
issn = "0167-9317",
publisher = "Elsevier",

}

RIS

TY - JOUR

T1 - Direct e-beam lithography of PDMS

AU - Bowen, James

AU - Cheneler, David

AU - Robinson, Alex

PY - 2012/9

Y1 - 2012/9

N2 - In this paper, the viability of directly exposing thin films of liquid poly(dimethylsiloxane) (PDMS) to electron beam (e-beam) irradiation using e-beam lithographic methods for the purpose of creating permanent micro-scale components has been investigated. By exposing 1.1 μm thickness PDMS films to doses in the range 10–50,000 μC/cm2, it was discovered that the structure of the resultant film exhibits four distinct phases, depending upon the exposure dose. These phases were manifested in both the resultant Young’s modulus and thickness of the developed film. It was found that there is a critical dose whereupon the resultant film undergoes solidification and adheres to the counter surface sufficiently to survive the development process. It has been shown that the Young’s modulus of the solid film can be varied over seven orders of magnitude, from that of a viscoelastic material through a rubbery regime to that of a glassy one, by increasing the e-beam dose. At higher doses, excessive backscattering was observed, as well as film swelling, resulting in poor spatial resolution.

AB - In this paper, the viability of directly exposing thin films of liquid poly(dimethylsiloxane) (PDMS) to electron beam (e-beam) irradiation using e-beam lithographic methods for the purpose of creating permanent micro-scale components has been investigated. By exposing 1.1 μm thickness PDMS films to doses in the range 10–50,000 μC/cm2, it was discovered that the structure of the resultant film exhibits four distinct phases, depending upon the exposure dose. These phases were manifested in both the resultant Young’s modulus and thickness of the developed film. It was found that there is a critical dose whereupon the resultant film undergoes solidification and adheres to the counter surface sufficiently to survive the development process. It has been shown that the Young’s modulus of the solid film can be varied over seven orders of magnitude, from that of a viscoelastic material through a rubbery regime to that of a glassy one, by increasing the e-beam dose. At higher doses, excessive backscattering was observed, as well as film swelling, resulting in poor spatial resolution.

KW - e-Beam

KW - Lithography

KW - PDMS

KW - Poly(dimethylsiloxane)

U2 - 10.1016/j.mee.2012.02.049

DO - 10.1016/j.mee.2012.02.049

M3 - Journal article

VL - 97

SP - 34

EP - 37

JO - Microelectronic Engineering

JF - Microelectronic Engineering

SN - 0167-9317

ER -