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High density indium bumping using electrodeposition enhanced by megasonic agitation

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High density indium bumping using electrodeposition enhanced by megasonic agitation. / Tian, Yingtao; Liu, Changqing; Hutt, David et al.
Electronics Packaging Technology Conference, 2009. EPTC '09. 11th. IEEE, 2009. p. 31-35.

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

Harvard

Tian, Y, Liu, C, Hutt, D, Stevens, B, Flynn, D & Desmulliez, MPY 2009, High density indium bumping using electrodeposition enhanced by megasonic agitation. in Electronics Packaging Technology Conference, 2009. EPTC '09. 11th. IEEE, pp. 31-35. https://doi.org/10.1109/EPTC.2009.5416576

APA

Tian, Y., Liu, C., Hutt, D., Stevens, B., Flynn, D., & Desmulliez, M. P. Y. (2009). High density indium bumping using electrodeposition enhanced by megasonic agitation. In Electronics Packaging Technology Conference, 2009. EPTC '09. 11th (pp. 31-35). IEEE. https://doi.org/10.1109/EPTC.2009.5416576

Vancouver

Tian Y, Liu C, Hutt D, Stevens B, Flynn D, Desmulliez MPY. High density indium bumping using electrodeposition enhanced by megasonic agitation. In Electronics Packaging Technology Conference, 2009. EPTC '09. 11th. IEEE. 2009. p. 31-35 doi: 10.1109/EPTC.2009.5416576

Author

Tian, Yingtao ; Liu, Changqing ; Hutt, David et al. / High density indium bumping using electrodeposition enhanced by megasonic agitation. Electronics Packaging Technology Conference, 2009. EPTC '09. 11th. IEEE, 2009. pp. 31-35

Bibtex

@inproceedings{07a173099db74718b6d72f255dae0a92,
title = "High density indium bumping using electrodeposition enhanced by megasonic agitation",
abstract = "Electrodeposition has been utilized to fulfill the demand of high density indium bumping used in high energy physics applications. Previous studies have shown the capability of electrodeposition to achieve high yield and high density indium bumps. The challenge exists to improve the bump height uniformity and consistency of electroplated indium bumps across the wafer at ultra-fine pitches with the highest yield. This paper reports progress towards the electroplating indium bumping process assisted by megasonic agitation. Electroplating of indium onto non-patterned substrates was initially conducted to investigate the performance of the solution with megasonic agitation. Further trials were carried out on 4 inch silicon dummy wafers to create indium bumps at 50 μm pitch. The results reflect that bubbles created during the plating process with megasonic agitation can affect the quality of the deposit and the yield of indium bumping, under the experimental conditions used in this study.",
author = "Yingtao Tian and Changqing Liu and David Hutt and Bob Stevens and David Flynn and Desmulliez, {Marc P. Y.}",
year = "2009",
doi = "10.1109/EPTC.2009.5416576",
language = "English",
isbn = "9781424450992",
pages = "31--35",
booktitle = "Electronics Packaging Technology Conference, 2009. EPTC '09. 11th",
publisher = "IEEE",

}

RIS

TY - GEN

T1 - High density indium bumping using electrodeposition enhanced by megasonic agitation

AU - Tian, Yingtao

AU - Liu, Changqing

AU - Hutt, David

AU - Stevens, Bob

AU - Flynn, David

AU - Desmulliez, Marc P. Y.

PY - 2009

Y1 - 2009

N2 - Electrodeposition has been utilized to fulfill the demand of high density indium bumping used in high energy physics applications. Previous studies have shown the capability of electrodeposition to achieve high yield and high density indium bumps. The challenge exists to improve the bump height uniformity and consistency of electroplated indium bumps across the wafer at ultra-fine pitches with the highest yield. This paper reports progress towards the electroplating indium bumping process assisted by megasonic agitation. Electroplating of indium onto non-patterned substrates was initially conducted to investigate the performance of the solution with megasonic agitation. Further trials were carried out on 4 inch silicon dummy wafers to create indium bumps at 50 μm pitch. The results reflect that bubbles created during the plating process with megasonic agitation can affect the quality of the deposit and the yield of indium bumping, under the experimental conditions used in this study.

AB - Electrodeposition has been utilized to fulfill the demand of high density indium bumping used in high energy physics applications. Previous studies have shown the capability of electrodeposition to achieve high yield and high density indium bumps. The challenge exists to improve the bump height uniformity and consistency of electroplated indium bumps across the wafer at ultra-fine pitches with the highest yield. This paper reports progress towards the electroplating indium bumping process assisted by megasonic agitation. Electroplating of indium onto non-patterned substrates was initially conducted to investigate the performance of the solution with megasonic agitation. Further trials were carried out on 4 inch silicon dummy wafers to create indium bumps at 50 μm pitch. The results reflect that bubbles created during the plating process with megasonic agitation can affect the quality of the deposit and the yield of indium bumping, under the experimental conditions used in this study.

U2 - 10.1109/EPTC.2009.5416576

DO - 10.1109/EPTC.2009.5416576

M3 - Conference contribution/Paper

SN - 9781424450992

SP - 31

EP - 35

BT - Electronics Packaging Technology Conference, 2009. EPTC '09. 11th

PB - IEEE

ER -