Problems of the radiated EMI from printed circuit board (PCB) edge have been widely studied for a long time. However, most of those publications stay in the frequency lower than 20 GHz. With the development of high-speed communication and some new generation telecommunication technologies, the operating frequency is moving higher and higher. This paper investigates the radiated EMI from PCB edge up to 100 GHz, by using the full-wave simulation. To simplify the study, the PCB has been modeled as a two-dimensional (2D) approach by using periodical boundary. The impacts of different PCB parameters, such as the substrate thickness, dielectric constant, dielectric loss and multi-layers, have been studied in this paper, together with a 3D PCB model for reference. It's found that the PCB thickness and the dielectric constant affect the edge radiation a lot. For instance, the radiation of the PCB with 0.508 mm thickness increases by 0.06 dB/GHz, whereas the one with 1.524 mm thickness increases by 0.22 dB/GHz.