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Investigation of SU8 as a structural material for fabricating passive millimeter-wave and terahertz components

Research output: Contribution to Journal/MagazineJournal articlepeer-review

Published

Standard

Investigation of SU8 as a structural material for fabricating passive millimeter-wave and terahertz components. / Tian, Yingtao; Shang, Xiaobang; Wang, Yi et al.
In: Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 14, No. 4, 044507, 10.2015.

Research output: Contribution to Journal/MagazineJournal articlepeer-review

Harvard

Tian, Y, Shang, X, Wang, Y & Lancaster, MJ 2015, 'Investigation of SU8 as a structural material for fabricating passive millimeter-wave and terahertz components', Journal of Micro/Nanolithography, MEMS, and MOEMS, vol. 14, no. 4, 044507. https://doi.org/10.1117/1.JMM.14.4.044507

APA

Tian, Y., Shang, X., Wang, Y., & Lancaster, M. J. (2015). Investigation of SU8 as a structural material for fabricating passive millimeter-wave and terahertz components. Journal of Micro/Nanolithography, MEMS, and MOEMS, 14(4), Article 044507. https://doi.org/10.1117/1.JMM.14.4.044507

Vancouver

Tian Y, Shang X, Wang Y, Lancaster MJ. Investigation of SU8 as a structural material for fabricating passive millimeter-wave and terahertz components. Journal of Micro/Nanolithography, MEMS, and MOEMS. 2015 Oct;14(4):044507. doi: 10.1117/1.JMM.14.4.044507

Author

Tian, Yingtao ; Shang, Xiaobang ; Wang, Yi et al. / Investigation of SU8 as a structural material for fabricating passive millimeter-wave and terahertz components. In: Journal of Micro/Nanolithography, MEMS, and MOEMS. 2015 ; Vol. 14, No. 4.

Bibtex

@article{6c9a9518b26f4da1bb9c3e07f3fd4168,
title = "Investigation of SU8 as a structural material for fabricating passive millimeter-wave and terahertz components",
abstract = "This paper provides a systematic review of the technical issues of SU8 fabrication for millimeter-wave and terahertz components based on research carried out at the University of Birmingham in the past decade. A design-for-manufacturability approach is followed. The flexibility of the SU8 process enables many device structures. Challenges and problems during fabrication will be discussed and demonstrated with examples. The measurement of the devices is also a significant challenge when the critical dimensions of the device shrink and special testing fixtures are needed in some cases. Finally, a brief overview of the issues discussed above is given for future guidance.",
author = "Yingtao Tian and Xiaobang Shang and Yi Wang and Lancaster, {Michael J.}",
year = "2015",
month = oct,
doi = "10.1117/1.JMM.14.4.044507",
language = "English",
volume = "14",
journal = "Journal of Micro/Nanolithography, MEMS, and MOEMS",
issn = "1932-5150",
publisher = "SPIE",
number = "4",

}

RIS

TY - JOUR

T1 - Investigation of SU8 as a structural material for fabricating passive millimeter-wave and terahertz components

AU - Tian, Yingtao

AU - Shang, Xiaobang

AU - Wang, Yi

AU - Lancaster, Michael J.

PY - 2015/10

Y1 - 2015/10

N2 - This paper provides a systematic review of the technical issues of SU8 fabrication for millimeter-wave and terahertz components based on research carried out at the University of Birmingham in the past decade. A design-for-manufacturability approach is followed. The flexibility of the SU8 process enables many device structures. Challenges and problems during fabrication will be discussed and demonstrated with examples. The measurement of the devices is also a significant challenge when the critical dimensions of the device shrink and special testing fixtures are needed in some cases. Finally, a brief overview of the issues discussed above is given for future guidance.

AB - This paper provides a systematic review of the technical issues of SU8 fabrication for millimeter-wave and terahertz components based on research carried out at the University of Birmingham in the past decade. A design-for-manufacturability approach is followed. The flexibility of the SU8 process enables many device structures. Challenges and problems during fabrication will be discussed and demonstrated with examples. The measurement of the devices is also a significant challenge when the critical dimensions of the device shrink and special testing fixtures are needed in some cases. Finally, a brief overview of the issues discussed above is given for future guidance.

U2 - 10.1117/1.JMM.14.4.044507

DO - 10.1117/1.JMM.14.4.044507

M3 - Journal article

VL - 14

JO - Journal of Micro/Nanolithography, MEMS, and MOEMS

JF - Journal of Micro/Nanolithography, MEMS, and MOEMS

SN - 1932-5150

IS - 4

M1 - 044507

ER -