Accepted author manuscript, 4.24 MB, PDF document
Final published version
Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review
Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review
}
TY - GEN
T1 - MakeDevice
T2 - Evolving Devices Beyond the Prototype with Jacdac
AU - Hartley, Kobi
AU - Finney, Joe
AU - Hodges, Steve
AU - de Halleux, Peli
AU - Devine, James
AU - D'amone, Gabriele
PY - 2023/2/26
Y1 - 2023/2/26
N2 - Embedded devices are now commonplace, and hardware prototyping toolkits have become a popular approach for hobbyists and professionals to create embedded hardware prototypes. However, moving from prototype into small scale manufacture use introduces complexity and cost, restricting embedded device development 'beyond the prototype'. Challenges include the need to design custom PCB for manufacture, and the design and fabrication of a device enclosure to ensure the robust enough for deployment. In response, we present MakeDevice : A web-based tool that leverages an existing modular hardware prototyping platform, Jacdac, to enable low-complexity route to generate a custom carrier' PCB upon which modules can be mounted and electrically connected. MakeDevice also automatically generates CAD files for custom enclosures with apertures to suit. We show how such enclosures can be generated using 3D printing and 2D stencils. In this way, MakeDevice lowers the barriers in moving from prototype to viable low-volume deployment of embedded hardware.
AB - Embedded devices are now commonplace, and hardware prototyping toolkits have become a popular approach for hobbyists and professionals to create embedded hardware prototypes. However, moving from prototype into small scale manufacture use introduces complexity and cost, restricting embedded device development 'beyond the prototype'. Challenges include the need to design custom PCB for manufacture, and the design and fabrication of a device enclosure to ensure the robust enough for deployment. In response, we present MakeDevice : A web-based tool that leverages an existing modular hardware prototyping platform, Jacdac, to enable low-complexity route to generate a custom carrier' PCB upon which modules can be mounted and electrically connected. MakeDevice also automatically generates CAD files for custom enclosures with apertures to suit. We show how such enclosures can be generated using 3D printing and 2D stencils. In this way, MakeDevice lowers the barriers in moving from prototype to viable low-volume deployment of embedded hardware.
U2 - 10.1145/3569009.3573106
DO - 10.1145/3569009.3573106
M3 - Conference contribution/Paper
T3 - ACM International Conference Proceeding Series
SP - 1
EP - 7
BT - TEI 2023 - Proceedings of the 17th International Conference on Tangible, Embedded, and Embodied Interaction
ER -