Home > Research > Publications & Outputs > Megasonic agitation for enhanced electrodeposit...

Research

Links

Text available via DOI:

Keywords

View graph of relations

Megasonic agitation for enhanced electrodeposition of copper

Research output: Contribution to Journal/Magazine › Journal article › peer-review

Published

Standard

Megasonic agitation for enhanced electrodeposition of copper. / Kaufmann, Jens Georg; Desmulliez, Marc P. Y.; Tian, Yingtao et al.
In: Microsystem Technologies, Vol. 15, No. 8, 08.2009, p. 1245-1254.

Research output: Contribution to Journal/Magazine › Journal article › peer-review

Harvard

Kaufmann, JG, Desmulliez, MPY, Tian, Y, Price, D, Hughes, M, Strusevich, N, Bailey, C, Liu, C & Hutt, D 2009, 'Megasonic agitation for enhanced electrodeposition of copper', Microsystem Technologies, vol. 15, no. 8, pp. 1245-1254. https://doi.org/10.1007/s00542-009-0886-2

APA

Kaufmann, J. G., Desmulliez, M. P. Y., Tian, Y., Price, D., Hughes, M., Strusevich, N., Bailey, C., Liu, C., & Hutt, D. (2009). Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15(8), 1245-1254. https://doi.org/10.1007/s00542-009-0886-2

Vancouver

Kaufmann JG, Desmulliez MPY, Tian Y, Price D, Hughes M, Strusevich N et al. Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies. 2009 Aug;15(8):1245-1254. doi: 10.1007/s00542-009-0886-2

Author

Kaufmann, Jens Georg ; Desmulliez, Marc P. Y. ; Tian, Yingtao et al. / Megasonic agitation for enhanced electrodeposition of copper. In: Microsystem Technologies. 2009 ; Vol. 15, No. 8. pp. 1245-1254.

Bibtex

@article{9f1aa425cacd44d3b6bd3515f92668a3,
title = "Megasonic agitation for enhanced electrodeposition of copper",
abstract = "In this paper we propose an agitation method based on megasonic acoustic streaming to overcome the limitations in plating rate and uniformity of the metal deposits during the electroplating process. Megasonic agitation at a frequency of 1 MHz allows the reduction of the thickness of the Nernst diffusion layer to less than 600 nm. Two applications that demonstrate the benefits of megasonic acoustic streaming are presented: the formation of uniform ultra-fine pitch flip-chip bumps and the metallisation of high aspect ratio microvias. For the latter application, a multi-physics based numerical simulation is implemented to describe the hydrodynamics introduced by the acoustic waves as they travel inside the deep microvias.",
keywords = "Trench, Print Circuit Board, Seed Layer, Acoustic Streaming, Copper Electrodeposition ",
author = "Kaufmann, {Jens Georg} and Desmulliez, {Marc P. Y.} and Yingtao Tian and Dennis Price and Mike Hughes and Nadia Strusevich and Chris Bailey and Changqing Liu and David Hutt",
year = "2009",
month = aug,
doi = "10.1007/s00542-009-0886-2",
language = "English",
volume = "15",
pages = "1245--1254",
journal = "Microsystem Technologies",
issn = "0946-7076",
publisher = "Springer Verlag",
number = "8",

}

RIS

TY - JOUR

T1 - Megasonic agitation for enhanced electrodeposition of copper

AU - Kaufmann, Jens Georg

AU - Desmulliez, Marc P. Y.

AU - Tian, Yingtao

AU - Price, Dennis

AU - Hughes, Mike

AU - Strusevich, Nadia

AU - Bailey, Chris

AU - Liu, Changqing

AU - Hutt, David

PY - 2009/8

Y1 - 2009/8

N2 - In this paper we propose an agitation method based on megasonic acoustic streaming to overcome the limitations in plating rate and uniformity of the metal deposits during the electroplating process. Megasonic agitation at a frequency of 1 MHz allows the reduction of the thickness of the Nernst diffusion layer to less than 600 nm. Two applications that demonstrate the benefits of megasonic acoustic streaming are presented: the formation of uniform ultra-fine pitch flip-chip bumps and the metallisation of high aspect ratio microvias. For the latter application, a multi-physics based numerical simulation is implemented to describe the hydrodynamics introduced by the acoustic waves as they travel inside the deep microvias.

AB - In this paper we propose an agitation method based on megasonic acoustic streaming to overcome the limitations in plating rate and uniformity of the metal deposits during the electroplating process. Megasonic agitation at a frequency of 1 MHz allows the reduction of the thickness of the Nernst diffusion layer to less than 600 nm. Two applications that demonstrate the benefits of megasonic acoustic streaming are presented: the formation of uniform ultra-fine pitch flip-chip bumps and the metallisation of high aspect ratio microvias. For the latter application, a multi-physics based numerical simulation is implemented to describe the hydrodynamics introduced by the acoustic waves as they travel inside the deep microvias.

KW - Trench

KW - Print Circuit Board

KW - Seed Layer

KW - Acoustic Streaming

KW - Copper Electrodeposition

U2 - 10.1007/s00542-009-0886-2

DO - 10.1007/s00542-009-0886-2

M3 - Journal article

VL - 15

SP - 1245

EP - 1254

JO - Microsystem Technologies

JF - Microsystem Technologies

SN - 0946-7076

IS - 8

ER -