Research output: Contribution to Journal/Magazine › Journal article › peer-review
Research output: Contribution to Journal/Magazine › Journal article › peer-review
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TY - JOUR
T1 - Methodology for the preparation of polymer samples containing silicon microchips for mechanical testing
AU - Metje, Nicole
AU - Kolonko, Anna
AU - Chapman, David
AU - Cheneler, David
AU - Kukureka, Stephen
PY - 2013
Y1 - 2013
N2 - To produce monitoring systems for plastic pipes one option is to distribute sensors within the plastic matrix. However, little is known of the effects of these sensors on the structural integrity of the pipes. Although testing the whole pipe structure would be ideal, to understand this problem at a fundamental level, small polymer samples were produced in the laboratory using compression moulding. This article describes new methods of inserting discrete square and circular silicon microchips of a few millimetres in size at different positions and orientations into pipe-grade polymer highlighting the importance of controlling the manufacturing conditions.
AB - To produce monitoring systems for plastic pipes one option is to distribute sensors within the plastic matrix. However, little is known of the effects of these sensors on the structural integrity of the pipes. Although testing the whole pipe structure would be ideal, to understand this problem at a fundamental level, small polymer samples were produced in the laboratory using compression moulding. This article describes new methods of inserting discrete square and circular silicon microchips of a few millimetres in size at different positions and orientations into pipe-grade polymer highlighting the importance of controlling the manufacturing conditions.
KW - Compression moulding
KW - Flexural bending tests
KW - Insertion of microchips
KW - Polymer inclusions
KW - Tensile tests
U2 - 10.1080/03602559.2012.757623
DO - 10.1080/03602559.2012.757623
M3 - Journal article
VL - 52
SP - 461
EP - 471
JO - Polymer-Plastics Technology and Engineering
JF - Polymer-Plastics Technology and Engineering
SN - 0360-2559
IS - 5
ER -