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Mixed-signal custom IC control processors incorporating design for test/self-test.

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

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Mixed-signal custom IC control processors incorporating design for test/self-test. / Grout, I.; Burge, S. E.; Winsby, A. J.
IEE Colloquium on DSP Chips in Real Time Measurement and Control (Digest No: 1997/301). Leicester: IEEE, 1998. p. 1/1-1/4.

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

Harvard

Grout, I, Burge, SE & Winsby, AJ 1998, Mixed-signal custom IC control processors incorporating design for test/self-test. in IEE Colloquium on DSP Chips in Real Time Measurement and Control (Digest No: 1997/301). IEEE, Leicester, pp. 1/1-1/4. <http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=659705>

APA

Grout, I., Burge, S. E., & Winsby, A. J. (1998). Mixed-signal custom IC control processors incorporating design for test/self-test. In IEE Colloquium on DSP Chips in Real Time Measurement and Control (Digest No: 1997/301) (pp. 1/1-1/4). IEEE. http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=659705

Vancouver

Grout I, Burge SE, Winsby AJ. Mixed-signal custom IC control processors incorporating design for test/self-test. In IEE Colloquium on DSP Chips in Real Time Measurement and Control (Digest No: 1997/301). Leicester: IEEE. 1998. p. 1/1-1/4

Author

Grout, I. ; Burge, S. E. ; Winsby, A. J. / Mixed-signal custom IC control processors incorporating design for test/self-test. IEE Colloquium on DSP Chips in Real Time Measurement and Control (Digest No: 1997/301). Leicester : IEEE, 1998. pp. 1/1-1/4

Bibtex

@inbook{056c54e9b56d4d5db8880dfd1e8c1cbc,
title = "Mixed-signal custom IC control processors incorporating design for test/self-test.",
abstract = "With the continued move towards higher integration and the concept of “systems on a chip”, the realisation of custom DSP chips aimed specifically at measurement/control systems is becoming a potential solution. Size reduction, operating speed increase, increased functionality and improved reliability can be achieved by using a single custom IC (ASIC) or multichip module (MCM) solution with the majority, or all, of the electronics mounted in a single package. Here, a DSP core optimised for the application surrounded by the necessary input/output signal conditioning circuitry can be used. However, the increased level of integration requires suitable fabrication processes and effective “design for test” to ensure the integrity of both the design functionality and fabrication.",
keywords = "ASIC, DSP core, I/O signal conditioning circuitry, MCM, custom DSP chips, design-for-test, input/output signal, conditioning circuitry, mixed-signal custom IC control processors, multichip module, operating speed increase, self-test design, single custom IC, size reduction, digital signal processing chips",
author = "I. Grout and Burge, {S. E.} and Winsby, {A. J.}",
note = "{"}{\textcopyright}1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.{"} {"}This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.{"}",
year = "1998",
month = sep,
language = "English",
pages = "1/1--1/4",
booktitle = "IEE Colloquium on DSP Chips in Real Time Measurement and Control (Digest No: 1997/301)",
publisher = "IEEE",

}

RIS

TY - CHAP

T1 - Mixed-signal custom IC control processors incorporating design for test/self-test.

AU - Grout, I.

AU - Burge, S. E.

AU - Winsby, A. J.

N1 - "©1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE." "This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder."

PY - 1998/9

Y1 - 1998/9

N2 - With the continued move towards higher integration and the concept of “systems on a chip”, the realisation of custom DSP chips aimed specifically at measurement/control systems is becoming a potential solution. Size reduction, operating speed increase, increased functionality and improved reliability can be achieved by using a single custom IC (ASIC) or multichip module (MCM) solution with the majority, or all, of the electronics mounted in a single package. Here, a DSP core optimised for the application surrounded by the necessary input/output signal conditioning circuitry can be used. However, the increased level of integration requires suitable fabrication processes and effective “design for test” to ensure the integrity of both the design functionality and fabrication.

AB - With the continued move towards higher integration and the concept of “systems on a chip”, the realisation of custom DSP chips aimed specifically at measurement/control systems is becoming a potential solution. Size reduction, operating speed increase, increased functionality and improved reliability can be achieved by using a single custom IC (ASIC) or multichip module (MCM) solution with the majority, or all, of the electronics mounted in a single package. Here, a DSP core optimised for the application surrounded by the necessary input/output signal conditioning circuitry can be used. However, the increased level of integration requires suitable fabrication processes and effective “design for test” to ensure the integrity of both the design functionality and fabrication.

KW - ASIC

KW - DSP core

KW - I/O signal conditioning circuitry

KW - MCM

KW - custom DSP chips

KW - design-for-test

KW - input/output signal

KW - conditioning circuitry

KW - mixed-signal custom IC control processors

KW - multichip module

KW - operating speed increase

KW - self-test design

KW - single custom IC

KW - size reduction

KW - digital signal processing chips

M3 - Chapter

SP - 1/1-1/4

BT - IEE Colloquium on DSP Chips in Real Time Measurement and Control (Digest No: 1997/301)

PB - IEEE

CY - Leicester

ER -