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Multiphysical computation of the structural bending in a bottom-drive VCM

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Multiphysical computation of the structural bending in a bottom-drive VCM. / García-Moreno, Salatiel; Bandala-Sánchez, Manuel.
In: COMPEL - The International Journal for Computation and Mathematics in Electrical and Electronic Engineering, Vol. 35, No. 5, 05.09.2016, p. 1617-1624.

Research output: Contribution to Journal/MagazineJournal articlepeer-review

Harvard

García-Moreno, S & Bandala-Sánchez, M 2016, 'Multiphysical computation of the structural bending in a bottom-drive VCM', COMPEL - The International Journal for Computation and Mathematics in Electrical and Electronic Engineering, vol. 35, no. 5, pp. 1617-1624. https://doi.org/10.1108/COMPEL-09-2015-0341

APA

García-Moreno, S., & Bandala-Sánchez, M. (2016). Multiphysical computation of the structural bending in a bottom-drive VCM. COMPEL - The International Journal for Computation and Mathematics in Electrical and Electronic Engineering, 35(5), 1617-1624. https://doi.org/10.1108/COMPEL-09-2015-0341

Vancouver

García-Moreno S, Bandala-Sánchez M. Multiphysical computation of the structural bending in a bottom-drive VCM. COMPEL - The International Journal for Computation and Mathematics in Electrical and Electronic Engineering. 2016 Sept 5;35(5):1617-1624. doi: 10.1108/COMPEL-09-2015-0341

Author

García-Moreno, Salatiel ; Bandala-Sánchez, Manuel. / Multiphysical computation of the structural bending in a bottom-drive VCM. In: COMPEL - The International Journal for Computation and Mathematics in Electrical and Electronic Engineering. 2016 ; Vol. 35, No. 5. pp. 1617-1624.

Bibtex

@article{065f4b9512f74af983839f1a37f15f7a,
title = "Multiphysical computation of the structural bending in a bottom-drive VCM",
abstract = "Purpose - This paper intends to lay a background knowledge towards the feasibility of developing a bottom-drive variable capacitance micromotor (VCM) using a surface micromachining process (SMP). The purpose of this paper is to determine the possibility of neglecting the bending of the rotor plates caused by the electrostatic normal forces when deploying a set of mechanical supports. Design/methodology/approach -A multiphysics simulation approach is considered in order to analyse the coupled electromechanical effects in a steady state and to evaluate if the proposed geometries are useful to reduce the bending of the plates. Findings -A surfaced micromachined bottom-drive VCM requires mechanical reinforcement in order to eliminate the risk of an electrical short circuit caused by the deformation in the rotor plates. The combination of an external supporting ring and anchored structural ribs on top of the rotor poles is sufficient to neglect the deformation in the poles of the rotor. Originality/value -An original analysis with the objective of setting a background in the development of a bottom-drive electrostatic micromotor using a SMP is presented.",
keywords = "Micromotor, Plate bending, Surface micromachining, Variable capacitance",
author = "Salatiel Garc{\'i}a-Moreno and Manuel Bandala-S{\'a}nchez",
year = "2016",
month = sep,
day = "5",
doi = "10.1108/COMPEL-09-2015-0341",
language = "English",
volume = "35",
pages = "1617--1624",
journal = "COMPEL - The International Journal for Computation and Mathematics in Electrical and Electronic Engineering",
issn = "0332-1649",
publisher = "Emerald Group Publishing Ltd.",
number = "5",

}

RIS

TY - JOUR

T1 - Multiphysical computation of the structural bending in a bottom-drive VCM

AU - García-Moreno, Salatiel

AU - Bandala-Sánchez, Manuel

PY - 2016/9/5

Y1 - 2016/9/5

N2 - Purpose - This paper intends to lay a background knowledge towards the feasibility of developing a bottom-drive variable capacitance micromotor (VCM) using a surface micromachining process (SMP). The purpose of this paper is to determine the possibility of neglecting the bending of the rotor plates caused by the electrostatic normal forces when deploying a set of mechanical supports. Design/methodology/approach -A multiphysics simulation approach is considered in order to analyse the coupled electromechanical effects in a steady state and to evaluate if the proposed geometries are useful to reduce the bending of the plates. Findings -A surfaced micromachined bottom-drive VCM requires mechanical reinforcement in order to eliminate the risk of an electrical short circuit caused by the deformation in the rotor plates. The combination of an external supporting ring and anchored structural ribs on top of the rotor poles is sufficient to neglect the deformation in the poles of the rotor. Originality/value -An original analysis with the objective of setting a background in the development of a bottom-drive electrostatic micromotor using a SMP is presented.

AB - Purpose - This paper intends to lay a background knowledge towards the feasibility of developing a bottom-drive variable capacitance micromotor (VCM) using a surface micromachining process (SMP). The purpose of this paper is to determine the possibility of neglecting the bending of the rotor plates caused by the electrostatic normal forces when deploying a set of mechanical supports. Design/methodology/approach -A multiphysics simulation approach is considered in order to analyse the coupled electromechanical effects in a steady state and to evaluate if the proposed geometries are useful to reduce the bending of the plates. Findings -A surfaced micromachined bottom-drive VCM requires mechanical reinforcement in order to eliminate the risk of an electrical short circuit caused by the deformation in the rotor plates. The combination of an external supporting ring and anchored structural ribs on top of the rotor poles is sufficient to neglect the deformation in the poles of the rotor. Originality/value -An original analysis with the objective of setting a background in the development of a bottom-drive electrostatic micromotor using a SMP is presented.

KW - Micromotor

KW - Plate bending

KW - Surface micromachining

KW - Variable capacitance

U2 - 10.1108/COMPEL-09-2015-0341

DO - 10.1108/COMPEL-09-2015-0341

M3 - Journal article

AN - SCOPUS:84987753793

VL - 35

SP - 1617

EP - 1624

JO - COMPEL - The International Journal for Computation and Mathematics in Electrical and Electronic Engineering

JF - COMPEL - The International Journal for Computation and Mathematics in Electrical and Electronic Engineering

SN - 0332-1649

IS - 5

ER -