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  • Ultrasound welding of Al-Cu - final

    Rights statement: The final publication is available at Springer via http://dx.doi.org/10.1134/S0031918X20140173

    Accepted author manuscript, 1.69 MB, PDF document

    Embargo ends: 31/12/21

    Available under license: CC BY-NC: Creative Commons Attribution-NonCommercial 4.0 International License

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Study on Ultrasound Welding Process of Aluminum/Copper Dissimilar Metals

Research output: Contribution to journalJournal articlepeer-review

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  • Man Tang
  • P. Zhang
  • Z. Yu
  • H. Shi
  • S. Li
  • D. Wu
  • H. Yan
  • X. Ye
  • F. Wang
  • Y. Tian
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<mark>Journal publication date</mark>31/12/2020
<mark>Journal</mark>Physics of Metals and Metallography
Issue number14
Volume121
Number of pages11
Pages (from-to)1400-1410
Publication StatusPublished
<mark>Original language</mark>English

Abstract

Abstract: Aluminum/copper dissimilar joints are widely used in electronics, the automobile industry, and battery manufacturing. Ultrasonic spot welding (USW), as a quality, efficient, clean, and low-consumption solid phase bonding (SPB) technology, is applicable for the connections of aluminum/copper and other highly conductive and heat-conducting materials. At present, this technique has been applied by automobile producers and lithium battery manufacturers at home and abroad. In this work, the optimal performance of the ultrasonic welding process of aluminum/copper dissimilar joints was studied. Based on a single-factor test on how welding parameters (lap mode, welding pressure, welding amplitude, and welding energy) influence the quality of welding joints, the lap mode of aluminum plates on the top and copper plates on the bottom (Al/Cu) was deemed better than that of copper plates on the top and aluminum plates on the bottom (Cu/Al) under the same optimal parameters (40 psi, 45 μm, and 500 J). With this group of parameters, the Al/Cu joint formed a cladding mechanical occlusion. The element had a diffusion layer of 2 μm and a joint specimen maximum failure load of 605 N. © 2020, Pleiades Publishing, Ltd.

Bibliographic note

The final publication is available at Springer via http://dx.doi.org/10.1134/S0031918X20140173