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  • TEI_TangibleTouch_Pictorial

    Rights statement: © ACM, 2022. This is the author's version of the work. It is posted here by permission of ACM for your personal use. Not for redistribution. The definitive version was published in TEI '22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction February 2022 http://doi.acm.org/10.1145/3490149.3502263

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TangibleTouch: A Toolkit for Designing Surface-based Gestures for Tangible Interfaces

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNConference contribution/Paperpeer-review

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TangibleTouch: A Toolkit for Designing Surface-based Gestures for Tangible Interfaces. / Potts, Dominic; Dabravalskis, Martynas; Houben, Steven.
TEI'22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction. New York : ACM, 2022. p. 1-14 39.

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNConference contribution/Paperpeer-review

Harvard

Potts, D, Dabravalskis, M & Houben, S 2022, TangibleTouch: A Toolkit for Designing Surface-based Gestures for Tangible Interfaces. in TEI'22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction., 39, ACM, New York , pp. 1-14. https://doi.org/10.1145/3490149.3502263

APA

Potts, D., Dabravalskis, M., & Houben, S. (2022). TangibleTouch: A Toolkit for Designing Surface-based Gestures for Tangible Interfaces. In TEI'22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction (pp. 1-14). Article 39 ACM. https://doi.org/10.1145/3490149.3502263

Vancouver

Potts D, Dabravalskis M, Houben S. TangibleTouch: A Toolkit for Designing Surface-based Gestures for Tangible Interfaces. In TEI'22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction. New York : ACM. 2022. p. 1-14. 39 doi: 10.1145/3490149.3502263

Author

Potts, Dominic ; Dabravalskis, Martynas ; Houben, Steven. / TangibleTouch : A Toolkit for Designing Surface-based Gestures for Tangible Interfaces. TEI'22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction. New York : ACM, 2022. pp. 1-14

Bibtex

@inproceedings{7ec7f762b5a442e797f998b719e38091,
title = "TangibleTouch: A Toolkit for Designing Surface-based Gestures for Tangible Interfaces",
abstract = "This pictorial introduces TangibleTouch, a toolkit to design and build interactive tangible cubes using capacitive sensing. This toolkit enables designers to quickly prototype and explore tangible cubes with exchangeable capacitive panels that allows touch-based gestures and interactions that can be used for tangible input in VR, AR, or physical computing. We introduce a design space for TangibleTouch, and present the technical implementation, fabrication approaches, and software support for designers. We evaluate our toolkit by demonstrating its use and application for 3 different case studies: a media controller, a platform game, and a 3D model inspection tool. The contribution of our work is a novel toolkit method for constructing and fabricating a cube-based interactive tangible user interface. ",
keywords = "Tangibles, Gestural Interaction, Toolkit, Rapid Prototyping, Capacitive Sensing, Mixed Reality",
author = "Dominic Potts and Martynas Dabravalskis and Steven Houben",
note = "{\textcopyright} ACM, 2022. This is the author's version of the work. It is posted here by permission of ACM for your personal use. Not for redistribution. The definitive version was published in TEI '22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction February 2022 http://doi.acm.org/10.1145/3490149.3502263",
year = "2022",
month = feb,
day = "13",
doi = "10.1145/3490149.3502263",
language = "English",
pages = "1--14",
booktitle = "TEI'22",
publisher = "ACM",

}

RIS

TY - GEN

T1 - TangibleTouch

T2 - A Toolkit for Designing Surface-based Gestures for Tangible Interfaces

AU - Potts, Dominic

AU - Dabravalskis, Martynas

AU - Houben, Steven

N1 - © ACM, 2022. This is the author's version of the work. It is posted here by permission of ACM for your personal use. Not for redistribution. The definitive version was published in TEI '22: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction February 2022 http://doi.acm.org/10.1145/3490149.3502263

PY - 2022/2/13

Y1 - 2022/2/13

N2 - This pictorial introduces TangibleTouch, a toolkit to design and build interactive tangible cubes using capacitive sensing. This toolkit enables designers to quickly prototype and explore tangible cubes with exchangeable capacitive panels that allows touch-based gestures and interactions that can be used for tangible input in VR, AR, or physical computing. We introduce a design space for TangibleTouch, and present the technical implementation, fabrication approaches, and software support for designers. We evaluate our toolkit by demonstrating its use and application for 3 different case studies: a media controller, a platform game, and a 3D model inspection tool. The contribution of our work is a novel toolkit method for constructing and fabricating a cube-based interactive tangible user interface.

AB - This pictorial introduces TangibleTouch, a toolkit to design and build interactive tangible cubes using capacitive sensing. This toolkit enables designers to quickly prototype and explore tangible cubes with exchangeable capacitive panels that allows touch-based gestures and interactions that can be used for tangible input in VR, AR, or physical computing. We introduce a design space for TangibleTouch, and present the technical implementation, fabrication approaches, and software support for designers. We evaluate our toolkit by demonstrating its use and application for 3 different case studies: a media controller, a platform game, and a 3D model inspection tool. The contribution of our work is a novel toolkit method for constructing and fabricating a cube-based interactive tangible user interface.

KW - Tangibles

KW - Gestural Interaction

KW - Toolkit

KW - Rapid Prototyping

KW - Capacitive Sensing

KW - Mixed Reality

U2 - 10.1145/3490149.3502263

DO - 10.1145/3490149.3502263

M3 - Conference contribution/Paper

SP - 1

EP - 14

BT - TEI'22

PB - ACM

CY - New York

ER -