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TEI '08: Proceedings of the 2nd international conference on Tangible and embedded interaction

Research output: Book/Report/ProceedingsProceedings

Published

Standard

TEI '08: Proceedings of the 2nd international conference on Tangible and embedded interaction. / Schmidt, Albrecht (Editor); Gellersen, Hans (Editor); van den Hoven, Elise (Editor) et al.
New York: ACM, 2008. 254 p.

Research output: Book/Report/ProceedingsProceedings

Harvard

Schmidt, A, Gellersen, H, van den Hoven, E, Mazalek, A, Holleis, P & Villar, N (eds) 2008, TEI '08: Proceedings of the 2nd international conference on Tangible and embedded interaction. ACM, New York.

APA

Schmidt, A., Gellersen, H., van den Hoven, E., Mazalek, A., Holleis, P., & Villar, N. (Eds.) (2008). TEI '08: Proceedings of the 2nd international conference on Tangible and embedded interaction. ACM.

Vancouver

Schmidt A, (ed.), Gellersen H, (ed.), van den Hoven E, (ed.), Mazalek A, (ed.), Holleis P, (ed.), Villar N, (ed.). TEI '08: Proceedings of the 2nd international conference on Tangible and embedded interaction. New York: ACM, 2008. 254 p.

Author

Schmidt, Albrecht (Editor) ; Gellersen, Hans (Editor) ; van den Hoven, Elise (Editor) et al. / TEI '08: Proceedings of the 2nd international conference on Tangible and embedded interaction. New York : ACM, 2008. 254 p.

Bibtex

@book{995e86de8d0147c5b0617201a0ae1374,
title = "TEI '08: Proceedings of the 2nd international conference on Tangible and embedded interaction",
editor = "Albrecht Schmidt and Hans Gellersen and {van den Hoven}, Elise and Ali Mazalek and Paul Holleis and Nicolas Villar",
year = "2008",
language = "English",
isbn = "978-1-60558-004-3",
publisher = "ACM",

}

RIS

TY - BOOK

T1 - TEI '08: Proceedings of the 2nd international conference on Tangible and embedded interaction

A2 - Schmidt, Albrecht

A2 - Gellersen, Hans

A2 - van den Hoven, Elise

A2 - Mazalek, Ali

A2 - Holleis, Paul

A2 - Villar, Nicolas

PY - 2008

Y1 - 2008

M3 - Proceedings

SN - 978-1-60558-004-3

BT - TEI '08: Proceedings of the 2nd international conference on Tangible and embedded interaction

PB - ACM

CY - New York

ER -