Final published version, 821 KB, PDF document
Final published version
Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter (peer-reviewed) › peer-review
Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter (peer-reviewed) › peer-review
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TY - CHAP
T1 - Stress effects of silica particles in a semiconductor package molding compound
AU - Font, Francesc
AU - Hocking, Graeme
AU - Burton, David Antony
AU - Cregan, Vincent
AU - Iliev, Pavel
N1 - For the context of the report see Study Groups on http://www.macsi.ul.ie/
PY - 2016
Y1 - 2016
N2 - The stresses induced on a silicon chip encased in an epoxy compound are considered due to absorption of moisture and the presence of silica particles in the coating. A range of different approaches are considered including a one-dimensional model for the curvature due to the absorption of water in a bi-lateral sheet, numerical simulations for the stress at the molding compound-silicon die interface and a two-dimensional model in the complex plane.
AB - The stresses induced on a silicon chip encased in an epoxy compound are considered due to absorption of moisture and the presence of silica particles in the coating. A range of different approaches are considered including a one-dimensional model for the curvature due to the absorption of water in a bi-lateral sheet, numerical simulations for the stress at the molding compound-silicon die interface and a two-dimensional model in the complex plane.
M3 - Chapter (peer-reviewed)
SP - 1
EP - 23
BT - ESGI 110 Study Group Report
PB - University of Limerick
CY - Limerick
ER -