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Stress effects of silica particles in a semiconductor package molding compound

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter (peer-reviewed) › peer-review

Published

Standard

Stress effects of silica particles in a semiconductor package molding compound. / Font, Francesc; Hocking, Graeme; Burton, David Antony et al.
ESGI 110 Study Group Report. Limerick: University of Limerick, 2016. p. 1-23.

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter (peer-reviewed) › peer-review

Harvard

Font, F, Hocking, G, Burton, DA, Cregan, V & Iliev, P 2016, Stress effects of silica particles in a semiconductor package molding compound. in ESGI 110 Study Group Report. University of Limerick, Limerick, pp. 1-23. <http://www.macsi.ul.ie/Analog15.pdf>

APA

Font, F., Hocking, G., Burton, D. A., Cregan, V., & Iliev, P. (2016). Stress effects of silica particles in a semiconductor package molding compound. In ESGI 110 Study Group Report (pp. 1-23). University of Limerick. http://www.macsi.ul.ie/Analog15.pdf

Vancouver

Font F, Hocking G, Burton DA, Cregan V, Iliev P. Stress effects of silica particles in a semiconductor package molding compound. In ESGI 110 Study Group Report. Limerick: University of Limerick. 2016. p. 1-23

Author

Font, Francesc ; Hocking, Graeme ; Burton, David Antony et al. / Stress effects of silica particles in a semiconductor package molding compound. ESGI 110 Study Group Report. Limerick : University of Limerick, 2016. pp. 1-23

Bibtex

@inbook{b59431df0d6d4d0eb7fb7fedb5338839,
title = "Stress effects of silica particles in a semiconductor package molding compound",
abstract = "The stresses induced on a silicon chip encased in an epoxy compound are considered due to absorption of moisture and the presence of silica particles in the coating. A range of different approaches are considered including a one-dimensional model for the curvature due to the absorption of water in a bi-lateral sheet, numerical simulations for the stress at the molding compound-silicon die interface and a two-dimensional model in the complex plane.",
author = "Francesc Font and Graeme Hocking and Burton, {David Antony} and Vincent Cregan and Pavel Iliev",
note = "For the context of the report see Study Groups on http://www.macsi.ul.ie/",
year = "2016",
language = "English",
pages = "1--23",
booktitle = "ESGI 110 Study Group Report",
publisher = "University of Limerick",

}

RIS

TY - CHAP

T1 - Stress effects of silica particles in a semiconductor package molding compound

AU - Font, Francesc

AU - Hocking, Graeme

AU - Burton, David Antony

AU - Cregan, Vincent

AU - Iliev, Pavel

N1 - For the context of the report see Study Groups on http://www.macsi.ul.ie/

PY - 2016

Y1 - 2016

N2 - The stresses induced on a silicon chip encased in an epoxy compound are considered due to absorption of moisture and the presence of silica particles in the coating. A range of different approaches are considered including a one-dimensional model for the curvature due to the absorption of water in a bi-lateral sheet, numerical simulations for the stress at the molding compound-silicon die interface and a two-dimensional model in the complex plane.

AB - The stresses induced on a silicon chip encased in an epoxy compound are considered due to absorption of moisture and the presence of silica particles in the coating. A range of different approaches are considered including a one-dimensional model for the curvature due to the absorption of water in a bi-lateral sheet, numerical simulations for the stress at the molding compound-silicon die interface and a two-dimensional model in the complex plane.

M3 - Chapter (peer-reviewed)

SP - 1

EP - 23

BT - ESGI 110 Study Group Report

PB - University of Limerick

CY - Limerick

ER -