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Stress effects of silica particles in a semiconductor package molding compound

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter (peer-reviewed)peer-review

Publication date2016
Host publicationESGI 110 Study Group Report
Place of PublicationLimerick
PublisherUniversity of Limerick
Number of pages23
<mark>Original language</mark>English


The stresses induced on a silicon chip encased in an epoxy compound are considered due to absorption of moisture and the presence of silica particles in the coating. A range of different approaches are considered including a one-dimensional model for the curvature due to the absorption of water in a bi-lateral sheet, numerical simulations for the stress at the molding compound-silicon die interface and a two-dimensional model in the complex plane.

Bibliographic note

For the context of the report see Study Groups on http://www.macsi.ul.ie/