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Professor Andrew Richardson

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  1. 2006
  2. Published

    Modelling the behaviour of soldier joints for wafer level SIP.

    Liu, H., Strusevich, N., Stoyanov, S., Bailey, C., Richardson, A. M. D., Dumas, N., Yannou, J. M. & Georgel, V., 2006, Proceedings of the 8th IEEE electronics packaging technology conference..

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Chapter

  3. Published

    Design for Micro and Nano Manufacture; The "PATENT-DfMM Network of Excellence: Modelling and Simulation Cluster

    Richardson, A., Slattery, O. & Rencz, M., 1/04/2006, Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on. p. 1 -5 5 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

  4. Published

    Towards a health monitor for system in package with MEMS functionality.

    Dumas, N. & Richardson, A., 06/2006. 6 p.

    Research output: Contribution to conference - Without ISBN/ISSN › Conference paper › peer-review

  5. Published

    Built-in test of electrode degradation of multi-electrode array biosensors

    Liu, H., Dumas, N., Richardson, A., Heal, R. & Kerkhoff, H. G., 1/06/2006, Proceedings of the 12th IEEE International mixed signal testing workshop (IMSTW'06), Edinburgh, United Kingdom. Lancaster, UK: ISLI en Lancaster University, p. 136-141 6 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

  6. Published

    A capacitance and optical method for the static and dynamic characterization of micro electro mechanical systems (MEMS) devices.

    Richardson, A. M. D., Ferraris, E., Fassi, I., De Masi, B. & Rosing, R., 1/09/2006, In: Microsystem Technologies. 12, 10-11, p. 1053-1061 9 p.

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

  7. Published

    Guest editorial.

    Richardson, A. M. D., Mir, S. & Cheng, T., 12/2006, In: Journal of Electronic Testing. 22, 4-6, p. 311

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

  8. Published

    Investigation into the use of hybrid solutions for high resolution A/D converter testing.

    Lechner, A., Georgopoulos, K., Burbidge, M. & Richardson, A., 12/2006, In: Journal of Electronic Testing. 22, 4-6, p. 359-370 12 p.

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

  9. 2007
  10. Published

    A novel approach for online sensor testing based on an encoded test stimulus

    Dumas, N., Xu, Z., Georgopoulos, K., Bunyan, R. J. T. & Richardson, A., 2007, ETS 2007: 12th IEEE European Test Symposium, Proceedings. LOS ALAMITOS: IEEE COMPUTER SOC, p. 105-110 6 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

  11. Published

    System in Package Technology - Design for Manufacture Challenges.

    Richardson, A. M. D., Bailey, C., Dumas, N. & Yannou, J. M., 1/02/2007, In: Circuit World. 33, 1, p. 36-46 11 p.

    Research output: Contribution to Journal/Magazine › Journal article › peer-review

  12. Published

    Online sensor testing through superposition of encoded stimulus.

    Dumas, N., Xu, Z., Georgopoulos, K., Bunyan, J. & Richardson, A., 04/2007, Proceedings of the Design, Test, Integration and Packaging of MEMS/MOEMS, Stresa, Lago Maggiore, Italy, 25-27 April 2007.. 6 p.

    Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

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