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Compact modelling of through-silicon vias (TSVs) in three-dimensional (3-D) integrated circuits.

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Compact modelling of through-silicon vias (TSVs) in three-dimensional (3-D) integrated circuits. / Weerasekera, Roshan; Grange, M.; Pamunuwa, Dinesh Bandara et al.
Proceedings of the IEEE International Conference on 3D System Integration (3D IC), 2009. San Francisco: IEEE, 2009.

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

Harvard

Weerasekera, R, Grange, M, Pamunuwa, DB, Tenhunen, H & Zheng, L-R 2009, Compact modelling of through-silicon vias (TSVs) in three-dimensional (3-D) integrated circuits. in Proceedings of the IEEE International Conference on 3D System Integration (3D IC), 2009. IEEE, San Francisco. https://doi.org/10.1109/3DIC.2009.5306541

APA

Weerasekera, R., Grange, M., Pamunuwa, D. B., Tenhunen, H., & Zheng, L.-R. (2009). Compact modelling of through-silicon vias (TSVs) in three-dimensional (3-D) integrated circuits. In Proceedings of the IEEE International Conference on 3D System Integration (3D IC), 2009 IEEE. https://doi.org/10.1109/3DIC.2009.5306541

Vancouver

Weerasekera R, Grange M, Pamunuwa DB, Tenhunen H, Zheng LR. Compact modelling of through-silicon vias (TSVs) in three-dimensional (3-D) integrated circuits. In Proceedings of the IEEE International Conference on 3D System Integration (3D IC), 2009. San Francisco: IEEE. 2009 doi: 10.1109/3DIC.2009.5306541

Author

Weerasekera, Roshan ; Grange, M. ; Pamunuwa, Dinesh Bandara et al. / Compact modelling of through-silicon vias (TSVs) in three-dimensional (3-D) integrated circuits. Proceedings of the IEEE International Conference on 3D System Integration (3D IC), 2009. San Francisco : IEEE, 2009.

Bibtex

@inbook{7c188e0fa8e14cc5ae0de9b02f6a289c,
title = "Compact modelling of through-silicon vias (TSVs) in three-dimensional (3-D) integrated circuits.",
abstract = "Modeling parasitic parameters of Through-Silicon-Via (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circuits and interconnections in three-dimensional (3-D) integrated circuits (ICs). This paper presents a complete set of self-consistent equations including self and coupling terms for resistance, capacitance and inductance of various TSV structures. Further, a reduced-order electrical circuit model is proposed for isolated TSVs as well as bundled structures for delay and SI analysis, and extracted TSV parasitics are employed in Spectre simulations for performance evaluations. Critical issues in the performance modeling for design space exploration of 3-D ICs such as cross-talk induced switching pattern dependent delay variation and cross-talk on noise are discussed. The error in these metrics when using the proposed models as compared to a field solver is contained to a few percentage points.",
author = "Roshan Weerasekera and M. Grange and Pamunuwa, {Dinesh Bandara} and Hannu Tenhunen and Li-Rong Zheng",
note = "{"}{\textcopyright}2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.{"} {"}This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.{"}",
year = "2009",
month = oct,
doi = "10.1109/3DIC.2009.5306541",
language = "English",
isbn = "978-1-4244-4511-0",
booktitle = "Proceedings of the IEEE International Conference on 3D System Integration (3D IC), 2009",
publisher = "IEEE",

}

RIS

TY - CHAP

T1 - Compact modelling of through-silicon vias (TSVs) in three-dimensional (3-D) integrated circuits.

AU - Weerasekera, Roshan

AU - Grange, M.

AU - Pamunuwa, Dinesh Bandara

AU - Tenhunen, Hannu

AU - Zheng, Li-Rong

N1 - "©2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE." "This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder."

PY - 2009/10

Y1 - 2009/10

N2 - Modeling parasitic parameters of Through-Silicon-Via (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circuits and interconnections in three-dimensional (3-D) integrated circuits (ICs). This paper presents a complete set of self-consistent equations including self and coupling terms for resistance, capacitance and inductance of various TSV structures. Further, a reduced-order electrical circuit model is proposed for isolated TSVs as well as bundled structures for delay and SI analysis, and extracted TSV parasitics are employed in Spectre simulations for performance evaluations. Critical issues in the performance modeling for design space exploration of 3-D ICs such as cross-talk induced switching pattern dependent delay variation and cross-talk on noise are discussed. The error in these metrics when using the proposed models as compared to a field solver is contained to a few percentage points.

AB - Modeling parasitic parameters of Through-Silicon-Via (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circuits and interconnections in three-dimensional (3-D) integrated circuits (ICs). This paper presents a complete set of self-consistent equations including self and coupling terms for resistance, capacitance and inductance of various TSV structures. Further, a reduced-order electrical circuit model is proposed for isolated TSVs as well as bundled structures for delay and SI analysis, and extracted TSV parasitics are employed in Spectre simulations for performance evaluations. Critical issues in the performance modeling for design space exploration of 3-D ICs such as cross-talk induced switching pattern dependent delay variation and cross-talk on noise are discussed. The error in these metrics when using the proposed models as compared to a field solver is contained to a few percentage points.

U2 - 10.1109/3DIC.2009.5306541

DO - 10.1109/3DIC.2009.5306541

M3 - Chapter

SN - 978-1-4244-4511-0

BT - Proceedings of the IEEE International Conference on 3D System Integration (3D IC), 2009

PB - IEEE

CY - San Francisco

ER -