Home > Research > Publications & Outputs > Correlation of shear forces and heat conductanc...

Electronic data

Links

Text available via DOI:

View graph of relations

Correlation of shear forces and heat conductance in nanoscale junctions

Research output: Contribution to journalJournal articlepeer-review

Published

Standard

Correlation of shear forces and heat conductance in nanoscale junctions. / Robinson, Benjamin; Pumarol Crestar, Manuel; Kolosov, Oleg.

In: Physical Review B: Condensed Matter and Materials Physics, Vol. 100, No. 23, 235426, 16.12.2019.

Research output: Contribution to journalJournal articlepeer-review

Harvard

APA

Vancouver

Author

Robinson, Benjamin ; Pumarol Crestar, Manuel ; Kolosov, Oleg. / Correlation of shear forces and heat conductance in nanoscale junctions. In: Physical Review B: Condensed Matter and Materials Physics. 2019 ; Vol. 100, No. 23.

Bibtex

@article{7cbc10e6905c4cb094a8550f5923a7ce,
title = "Correlation of shear forces and heat conductance in nanoscale junctions",
abstract = "Nanoscale solid-solid contacts are key elements which determine the electrical and thermal behavior of modern electronic devices and micro- and nanoelectromechanical systems. Here we show that simultaneous measurements of the shear force and the heat flow in nanoscale junctions reveal a linear correlation between thermal conductance and maximal shear force, confirming the ballistic nature of heat transport in the junction. Furthermore, we find that here the shear strength and thermal conductance in nanoscale contacts for materials where heat transport is phonon dominated can be linked via the fundamental material properties of heat capacity and group velocity of the heat carriers.",
author = "Benjamin Robinson and {Pumarol Crestar}, Manuel and Oleg Kolosov",
note = "{\textcopyright} 2019 American Physical Society ",
year = "2019",
month = dec,
day = "16",
doi = "10.1103/PhysRevB.100.235426",
language = "English",
volume = "100",
journal = "Physical Review B: Condensed Matter and Materials Physics",
issn = "1098-0121",
publisher = "AMER PHYSICAL SOC",
number = "23",

}

RIS

TY - JOUR

T1 - Correlation of shear forces and heat conductance in nanoscale junctions

AU - Robinson, Benjamin

AU - Pumarol Crestar, Manuel

AU - Kolosov, Oleg

N1 - © 2019 American Physical Society

PY - 2019/12/16

Y1 - 2019/12/16

N2 - Nanoscale solid-solid contacts are key elements which determine the electrical and thermal behavior of modern electronic devices and micro- and nanoelectromechanical systems. Here we show that simultaneous measurements of the shear force and the heat flow in nanoscale junctions reveal a linear correlation between thermal conductance and maximal shear force, confirming the ballistic nature of heat transport in the junction. Furthermore, we find that here the shear strength and thermal conductance in nanoscale contacts for materials where heat transport is phonon dominated can be linked via the fundamental material properties of heat capacity and group velocity of the heat carriers.

AB - Nanoscale solid-solid contacts are key elements which determine the electrical and thermal behavior of modern electronic devices and micro- and nanoelectromechanical systems. Here we show that simultaneous measurements of the shear force and the heat flow in nanoscale junctions reveal a linear correlation between thermal conductance and maximal shear force, confirming the ballistic nature of heat transport in the junction. Furthermore, we find that here the shear strength and thermal conductance in nanoscale contacts for materials where heat transport is phonon dominated can be linked via the fundamental material properties of heat capacity and group velocity of the heat carriers.

U2 - 10.1103/PhysRevB.100.235426

DO - 10.1103/PhysRevB.100.235426

M3 - Journal article

VL - 100

JO - Physical Review B: Condensed Matter and Materials Physics

JF - Physical Review B: Condensed Matter and Materials Physics

SN - 1098-0121

IS - 23

M1 - 235426

ER -