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Defect formation in InGaAs/AlSb/InAs memory devices

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Defect formation in InGaAs/AlSb/InAs memory devices. / Trevisan, Aurelia; Hodgson, Peter; Lane, Dominic et al.
In: Journal of Vacuum Science and Technology B, Vol. 41, No. 4, 044001, 25.05.2023.

Research output: Contribution to Journal/MagazineJournal articlepeer-review

Harvard

Trevisan, A, Hodgson, P, Lane, D, Hayne, M & Koenraad, PM 2023, 'Defect formation in InGaAs/AlSb/InAs memory devices', Journal of Vacuum Science and Technology B, vol. 41, no. 4, 044001. https://doi.org/10.1116/6.0002677

APA

Trevisan, A., Hodgson, P., Lane, D., Hayne, M., & Koenraad, P. M. (2023). Defect formation in InGaAs/AlSb/InAs memory devices. Journal of Vacuum Science and Technology B, 41(4), Article 044001. https://doi.org/10.1116/6.0002677

Vancouver

Trevisan A, Hodgson P, Lane D, Hayne M, Koenraad PM. Defect formation in InGaAs/AlSb/InAs memory devices. Journal of Vacuum Science and Technology B. 2023 May 25;41(4):044001. doi: 10.1116/6.0002677

Author

Trevisan, Aurelia ; Hodgson, Peter ; Lane, Dominic et al. / Defect formation in InGaAs/AlSb/InAs memory devices. In: Journal of Vacuum Science and Technology B. 2023 ; Vol. 41, No. 4.

Bibtex

@article{a9f886dc853b40a6b132b5bd94d9c5cf,
title = "Defect formation in InGaAs/AlSb/InAs memory devices",
abstract = "ULTRARAMTM is a novel floating-gate nonvolatile memory in which the oxide barrier of flash is replaced by a triple-barrier resonant tunneling structure comprising of multiple InAs/AlSb heterojunctions. The quality of the triple barrier resonant tunneling heterostructure of an ULTRARAMTM device in terms of interface sharpness and the presence of defects was analyzed by cross-sectional scanning tunneling microscopy. We observed two different types of defects: stacking faults originating in the layers below the triple barrier resonant tunneling structure and AlSb accumulations at the interface between the lower AlSb layer of the triple barrier resonant tunneling structure and the InGaAs channel. The InGaAs surface of a second sample was measured by atomic force microscopy in order to investigate whether its unevenness is caused by deposition of the AlSb layer or it is already present before the AlSb deposition process.",
author = "Aurelia Trevisan and Peter Hodgson and Dominic Lane and Manus Hayne and P.M. Koenraad",
year = "2023",
month = may,
day = "25",
doi = "10.1116/6.0002677",
language = "English",
volume = "41",
journal = "Journal of Vacuum Science and Technology B",
issn = "1071-1023",
publisher = "AVS Science and Technology Society",
number = "4",

}

RIS

TY - JOUR

T1 - Defect formation in InGaAs/AlSb/InAs memory devices

AU - Trevisan, Aurelia

AU - Hodgson, Peter

AU - Lane, Dominic

AU - Hayne, Manus

AU - Koenraad, P.M.

PY - 2023/5/25

Y1 - 2023/5/25

N2 - ULTRARAMTM is a novel floating-gate nonvolatile memory in which the oxide barrier of flash is replaced by a triple-barrier resonant tunneling structure comprising of multiple InAs/AlSb heterojunctions. The quality of the triple barrier resonant tunneling heterostructure of an ULTRARAMTM device in terms of interface sharpness and the presence of defects was analyzed by cross-sectional scanning tunneling microscopy. We observed two different types of defects: stacking faults originating in the layers below the triple barrier resonant tunneling structure and AlSb accumulations at the interface between the lower AlSb layer of the triple barrier resonant tunneling structure and the InGaAs channel. The InGaAs surface of a second sample was measured by atomic force microscopy in order to investigate whether its unevenness is caused by deposition of the AlSb layer or it is already present before the AlSb deposition process.

AB - ULTRARAMTM is a novel floating-gate nonvolatile memory in which the oxide barrier of flash is replaced by a triple-barrier resonant tunneling structure comprising of multiple InAs/AlSb heterojunctions. The quality of the triple barrier resonant tunneling heterostructure of an ULTRARAMTM device in terms of interface sharpness and the presence of defects was analyzed by cross-sectional scanning tunneling microscopy. We observed two different types of defects: stacking faults originating in the layers below the triple barrier resonant tunneling structure and AlSb accumulations at the interface between the lower AlSb layer of the triple barrier resonant tunneling structure and the InGaAs channel. The InGaAs surface of a second sample was measured by atomic force microscopy in order to investigate whether its unevenness is caused by deposition of the AlSb layer or it is already present before the AlSb deposition process.

U2 - 10.1116/6.0002677

DO - 10.1116/6.0002677

M3 - Journal article

VL - 41

JO - Journal of Vacuum Science and Technology B

JF - Journal of Vacuum Science and Technology B

SN - 1071-1023

IS - 4

M1 - 044001

ER -