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Electrodeposition of indium bumps for ultrafine pitch interconnection

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Electrodeposition of indium bumps for ultrafine pitch interconnection. / Tian, Yingtao; Liu, Changqing; Hutt, David et al.
In: Journal of Electronic Materials, Vol. 43, No. 2, 02.2014, p. 594-603.

Research output: Contribution to Journal/Magazine › Journal article › peer-review

Harvard

Tian, Y, Liu, C, Hutt, D & Stevens, B 2014, 'Electrodeposition of indium bumps for ultrafine pitch interconnection', Journal of Electronic Materials, vol. 43, no. 2, pp. 594-603. https://doi.org/10.1007/s11664-013-2891-6

APA

Tian, Y., Liu, C., Hutt, D., & Stevens, B. (2014). Electrodeposition of indium bumps for ultrafine pitch interconnection. Journal of Electronic Materials, 43(2), 594-603. https://doi.org/10.1007/s11664-013-2891-6

Vancouver

Tian Y, Liu C, Hutt D, Stevens B. Electrodeposition of indium bumps for ultrafine pitch interconnection. Journal of Electronic Materials. 2014 Feb;43(2):594-603. Epub 2013 Nov 21. doi: 10.1007/s11664-013-2891-6

Author

Tian, Yingtao ; Liu, Changqing ; Hutt, David et al. / Electrodeposition of indium bumps for ultrafine pitch interconnection. In: Journal of Electronic Materials. 2014 ; Vol. 43, No. 2. pp. 594-603.

Bibtex

@article{9f69888d50ac41ed97fc0a33da39a77e,
title = "Electrodeposition of indium bumps for ultrafine pitch interconnection",
abstract = "Electroplating is a promising method to produce ultrafine pitch indium bumps for assembly of pixel detectors in imaging applications. In this work, the process of indium bumping through electrodeposition was demonstrated and the influences of various current waveforms on the bump morphology, microstructure and height uniformity were investigated. Electron microscopy was used to study the microstructure of electroplated indium bumps and a Zygo white light interferometer was utilised to evaluate the height uniformity. The results indicated that the bump uniformities on wafer, pattern and feature scales were improved by using unipolar pulse and bipolar pulse reverse current waveforms.",
keywords = "Electroplating, indium bumps, ultrafine pitch interconnection ",
author = "Yingtao Tian and Changqing Liu and David Hutt and Bob Stevens",
year = "2014",
month = feb,
doi = "10.1007/s11664-013-2891-6",
language = "English",
volume = "43",
pages = "594--603",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
publisher = "Springer New York",
number = "2",

}

RIS

TY - JOUR

T1 - Electrodeposition of indium bumps for ultrafine pitch interconnection

AU - Tian, Yingtao

AU - Liu, Changqing

AU - Hutt, David

AU - Stevens, Bob

PY - 2014/2

Y1 - 2014/2

N2 - Electroplating is a promising method to produce ultrafine pitch indium bumps for assembly of pixel detectors in imaging applications. In this work, the process of indium bumping through electrodeposition was demonstrated and the influences of various current waveforms on the bump morphology, microstructure and height uniformity were investigated. Electron microscopy was used to study the microstructure of electroplated indium bumps and a Zygo white light interferometer was utilised to evaluate the height uniformity. The results indicated that the bump uniformities on wafer, pattern and feature scales were improved by using unipolar pulse and bipolar pulse reverse current waveforms.

AB - Electroplating is a promising method to produce ultrafine pitch indium bumps for assembly of pixel detectors in imaging applications. In this work, the process of indium bumping through electrodeposition was demonstrated and the influences of various current waveforms on the bump morphology, microstructure and height uniformity were investigated. Electron microscopy was used to study the microstructure of electroplated indium bumps and a Zygo white light interferometer was utilised to evaluate the height uniformity. The results indicated that the bump uniformities on wafer, pattern and feature scales were improved by using unipolar pulse and bipolar pulse reverse current waveforms.

KW - Electroplating

KW - indium bumps

KW - ultrafine pitch interconnection

U2 - 10.1007/s11664-013-2891-6

DO - 10.1007/s11664-013-2891-6

M3 - Journal article

VL - 43

SP - 594

EP - 603

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 2

ER -