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Finite element analysis to support component level fault modelling for MEMS.

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

Published

Standard

Finite element analysis to support component level fault modelling for MEMS. / Reichenbach, R.; Rosing, R.; Richardson, Andrew M. D.; Dorey, A. P.

Proceedings of SPIE design, test, integration and packaging of MEMS symposium. Vol. 4408 2001. p. 147-158.

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNChapter

Harvard

Reichenbach, R, Rosing, R, Richardson, AMD & Dorey, AP 2001, Finite element analysis to support component level fault modelling for MEMS. in Proceedings of SPIE design, test, integration and packaging of MEMS symposium. vol. 4408, pp. 147-158.

APA

Reichenbach, R., Rosing, R., Richardson, A. M. D., & Dorey, A. P. (2001). Finite element analysis to support component level fault modelling for MEMS. In Proceedings of SPIE design, test, integration and packaging of MEMS symposium (Vol. 4408, pp. 147-158)

Vancouver

Reichenbach R, Rosing R, Richardson AMD, Dorey AP. Finite element analysis to support component level fault modelling for MEMS. In Proceedings of SPIE design, test, integration and packaging of MEMS symposium. Vol. 4408. 2001. p. 147-158

Author

Reichenbach, R. ; Rosing, R. ; Richardson, Andrew M. D. ; Dorey, A. P. / Finite element analysis to support component level fault modelling for MEMS. Proceedings of SPIE design, test, integration and packaging of MEMS symposium. Vol. 4408 2001. pp. 147-158

Bibtex

@inbook{66b81f4ff9914ab0a9977211c11e8c23,
title = "Finite element analysis to support component level fault modelling for MEMS.",
author = "R. Reichenbach and R. Rosing and Richardson, {Andrew M. D.} and Dorey, {A. P.}",
year = "2001",
language = "English",
volume = "4408",
pages = "147--158",
booktitle = "Proceedings of SPIE design, test, integration and packaging of MEMS symposium",

}

RIS

TY - CHAP

T1 - Finite element analysis to support component level fault modelling for MEMS.

AU - Reichenbach, R.

AU - Rosing, R.

AU - Richardson, Andrew M. D.

AU - Dorey, A. P.

PY - 2001

Y1 - 2001

M3 - Chapter

VL - 4408

SP - 147

EP - 158

BT - Proceedings of SPIE design, test, integration and packaging of MEMS symposium

ER -