Standard
Harvard
Reichenbach, R, Rosing, R
, Richardson, AMD & Dorey, AP 2001,
Finite element analysis to support component level fault modelling for MEMS. in
Proceedings of SPIE design, test, integration and packaging of MEMS symposium. vol. 4408, pp. 147-158.
APA
Reichenbach, R., Rosing, R.
, Richardson, A. M. D., & Dorey, A. P. (2001).
Finite element analysis to support component level fault modelling for MEMS. In
Proceedings of SPIE design, test, integration and packaging of MEMS symposium (Vol. 4408, pp. 147-158)
Vancouver
Author
Bibtex
@inbook{66b81f4ff9914ab0a9977211c11e8c23,
title = "Finite element analysis to support component level fault modelling for MEMS.",
author = "R. Reichenbach and R. Rosing and Richardson, {Andrew M. D.} and Dorey, {A. P.}",
year = "2001",
language = "English",
volume = "4408",
pages = "147--158",
booktitle = "Proceedings of SPIE design, test, integration and packaging of MEMS symposium",
}
RIS
TY - CHAP
T1 - Finite element analysis to support component level fault modelling for MEMS.
AU - Reichenbach, R.
AU - Rosing, R.
AU - Richardson, Andrew M. D.
AU - Dorey, A. P.
PY - 2001
Y1 - 2001
M3 - Chapter
VL - 4408
SP - 147
EP - 158
BT - Proceedings of SPIE design, test, integration and packaging of MEMS symposium
ER -
