Home > Research > Publications & Outputs > Investigation of high speed micro-bump formatio...

Links

Text available via DOI:

View graph of relations

Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSNConference contribution/Paperpeer-review

Published
  • Yingtao Tian
  • Changqing Liu
  • David Hutt
  • Bob Stevens
  • David Flynn
  • Marc P. Y. Desmulliez
Close
Publication date2011
Host publicationElectronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
PublisherIEEE
Pages739-744
Number of pages6
ISBN (electronic)9781457717697
ISBN (print)9781457717703
<mark>Original language</mark>English

Abstract

Electroplating has been employed to produce metallic micro-bumps to meet the demand of high density flip chip interconnections for high-end electronic devices. Previous studies indicated that megasonic agitation is a promising approach to enable high speed electrodeposition and bumping which therefore can increase the productivity and reduce the cost of the process. This paper takes indium bumping as an example and reports further investigation of the electroplating bumping enhanced by megasonic agitation. Experimental results demonstrate that the bumping process could be accelerated to five times faster than the ordinary DC electroplating situation without any significant effect on the bump height uniformity.