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Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation

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Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation. / Tian, Yingtao; Liu, Changqing; Hutt, David et al.
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. IEEE, 2011. p. 739-744.

Research output: Contribution in Book/Report/Proceedings - With ISBN/ISSN › Conference contribution/Paper › peer-review

Harvard

Tian, Y, Liu, C, Hutt, D, Stevens, B, Flynn, D & Desmulliez, MPY 2011, Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation. in Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. IEEE, pp. 739-744. https://doi.org/10.1109/ICEPT.2011.6066937

APA

Tian, Y., Liu, C., Hutt, D., Stevens, B., Flynn, D., & Desmulliez, M. P. Y. (2011). Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation. In Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on (pp. 739-744). IEEE. https://doi.org/10.1109/ICEPT.2011.6066937

Vancouver

Tian Y, Liu C, Hutt D, Stevens B, Flynn D, Desmulliez MPY. Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation. In Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. IEEE. 2011. p. 739-744 doi: 10.1109/ICEPT.2011.6066937

Author

Tian, Yingtao ; Liu, Changqing ; Hutt, David et al. / Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation. Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. IEEE, 2011. pp. 739-744

Bibtex

@inproceedings{8476d4a5eec141bab3b8b1a5b01b9cd1,
title = "Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation",
abstract = "Electroplating has been employed to produce metallic micro-bumps to meet the demand of high density flip chip interconnections for high-end electronic devices. Previous studies indicated that megasonic agitation is a promising approach to enable high speed electrodeposition and bumping which therefore can increase the productivity and reduce the cost of the process. This paper takes indium bumping as an example and reports further investigation of the electroplating bumping enhanced by megasonic agitation. Experimental results demonstrate that the bumping process could be accelerated to five times faster than the ordinary DC electroplating situation without any significant effect on the bump height uniformity.",
author = "Yingtao Tian and Changqing Liu and David Hutt and Bob Stevens and David Flynn and Desmulliez, {Marc P. Y.}",
year = "2011",
doi = "10.1109/ICEPT.2011.6066937",
language = "English",
isbn = "9781457717703",
pages = "739--744",
booktitle = "Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on",
publisher = "IEEE",

}

RIS

TY - GEN

T1 - Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation

AU - Tian, Yingtao

AU - Liu, Changqing

AU - Hutt, David

AU - Stevens, Bob

AU - Flynn, David

AU - Desmulliez, Marc P. Y.

PY - 2011

Y1 - 2011

N2 - Electroplating has been employed to produce metallic micro-bumps to meet the demand of high density flip chip interconnections for high-end electronic devices. Previous studies indicated that megasonic agitation is a promising approach to enable high speed electrodeposition and bumping which therefore can increase the productivity and reduce the cost of the process. This paper takes indium bumping as an example and reports further investigation of the electroplating bumping enhanced by megasonic agitation. Experimental results demonstrate that the bumping process could be accelerated to five times faster than the ordinary DC electroplating situation without any significant effect on the bump height uniformity.

AB - Electroplating has been employed to produce metallic micro-bumps to meet the demand of high density flip chip interconnections for high-end electronic devices. Previous studies indicated that megasonic agitation is a promising approach to enable high speed electrodeposition and bumping which therefore can increase the productivity and reduce the cost of the process. This paper takes indium bumping as an example and reports further investigation of the electroplating bumping enhanced by megasonic agitation. Experimental results demonstrate that the bumping process could be accelerated to five times faster than the ordinary DC electroplating situation without any significant effect on the bump height uniformity.

U2 - 10.1109/ICEPT.2011.6066937

DO - 10.1109/ICEPT.2011.6066937

M3 - Conference contribution/Paper

SN - 9781457717703

SP - 739

EP - 744

BT - Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

PB - IEEE

ER -